BSM200GB120DL Infineon Technologies AG, BSM200GB120DL Datasheet

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BSM200GB120DL

Manufacturer Part Number
BSM200GB120DL
Description
Manufacturer
Infineon Technologies AG
Datasheet

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IGBT Power Module
Preliminary data
Semiconductor Group
• Low Loss IGBT
• Low inductance halfbridge
• Including fast free- wheeling diodes
• Package with insulated metal base plate
Type
BSM 200 GB 120 DL
Maximum Ratings
Parameter
Collector-emitter voltage
Collector-gate voltage
R
Gate-emitter voltage
DC collector current
T
T
Pulsed collector current, t
T
T
Power dissipation per IGBT
T
Chip temperature
Storage temperature
Thermal resistance, chip case
Diode thermal resistance, chip case
Insulation test voltage, t = 1min.
Creepage distance
Clearance
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
C
C
C
C
C
GE
= 25 °C
= 80 °C
= 25 °C
= 80 °C
= 25 °C
= 20 k
p
= 1 ms
V
1200V 340A
CE
I
C
1
Package
HALF-BRIDGE 2
Symbol
V
V
V
I
I
P
T
T
R
R
V
-
-
-
-
C
Cpuls
j
stg
CE
CGR
GE
tot
is
thJC
thJCD
40 / 125 / 56
-40 ... + 125
BSM 200 GB 120 DL
Values
Ordering Code
C67076-A2300-A70
+ 150
± 20
1200
1200
1400
2500
340
200
680
400
F
0.09
0.18
20
11
Feb-14-1997
Unit
V
A
W
°C
K/W
Vac
mm
sec

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BSM200GB120DL Summary of contents

Page 1

IGBT Power Module Preliminary data • Low Loss IGBT • Low inductance halfbridge • Including fast free- wheeling diodes • Package with insulated metal base plate Type BSM 200 GB 120 DL Maximum Ratings Parameter Collector-emitter voltage Collector-gate voltage R ...

Page 2

Electrical Characteristics Parameter Static Characteristics Gate threshold voltage CE, C Collector-emitter saturation voltage 200 ...

Page 3

Electrical Characteristics Parameter Switching Characteristics, Inductive Load at T Turn-on delay time V = 600 4.7 Gon Rise time V = 600 ...

Page 4

Power dissipation tot C parameter: T 150 °C j 1500 W 1300 P 1200 tot 1100 1000 900 800 700 600 500 400 300 200 100 Collector current I ...

Page 5

Typ. output characteristics parameter µ ° 400 A 17V 15V I 13V C 300 11V 9V 7V 250 200 150 100 ...

Page 6

Typ. gate charge Gate parameter 200 A C puls 600 200 400 600 Reverse biased safe operating ...

Page 7

Typ. switching time inductive load , T = 125° par 600 ± ...

Page 8

Forward characteristics of fast recovery I = f(V ) reverse diode F F parameter 400 300 250 T =125°C j 200 150 100 50 0 0.0 0.5 1.0 1.5 Semiconductor Group Transient thermal impedance Z ...

Page 9

Package Outlines Dimensions in mm Weight: 420 g Semiconductor Group Circuit Diagram 9 BSM 200 GB 120 DL Feb-14-1997 ...

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