BU2508AF Philips Semiconductors, BU2508AF Datasheet
BU2508AF
Available stocks
Related parts for BU2508AF
BU2508AF Summary of contents
Page 1
... 4 1.1 A Csat B(end) PIN CONFIGURATION case CONDITIONS average over any 20 ms period ˚C hs CONDITIONS without heatsink compound with heatsink compound in free air 1 Product specification BU2508AF TYP. MAX. UNIT - 1500 V - 700 4 0.4 0.6 s ...
Page 2
... CONDITIONS MHz 4 1 Csat B(end (-dI / Csat B(end (-dI / Product specification BU2508AF MIN. TYP. MAX. UNIT - 2500 MIN. TYP. MAX. UNIT - - 1 2 1.0 mA 7.5 13.5 ...
Page 3
... Fig.4. Switching times definitions. CEOsust IBend -VBB min VCEOsust . Fig.5. Switching times test circuit . CEOsust ICsat 100 t IBend 0.01 t Fig.6. Typical DC current gain Product specification BU2508AF ICsat IBend t - IBM + 150 v nominal adjust for ICsat 1mH LB D.U.T. BY228 12nF ...
Page 4
... IC 4. 0.1 Fig.12. Typical collector storage and fall time Product specification BU2508AF 125 C 6A 4.5A 3A IC= sat = parameter 4.5A 3. 85˚ parameter kHz ...
Page 5
... Region of permissible DC operation Extension for repetitive pulse operation. NB: Mounted without heatsink compound and 30 the envelope. 100 120 140 = Product specification BU2508AF 0.01 ICM max IC max II Ptot max I 1000 1 10 100 VCE / V 5 newton force on the centre ...
Page 6
... Fig.16. SOT199; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1997 15.3 max 3.1 3.3 7.3 6.2 5.8 3 1.2 1.0 5.45 5.45 6 Product specification BU2508AF 5.2 max 3.2 seating plane 3.5 max not tinned 0.7 max 0.4 M 2.0 Rev 1.500 o 45 ...
Page 7
... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 7 Product specification BU2508AF Rev 1.500 ...