HEF40244BP,652 NXP Semiconductors, HEF40244BP,652 Datasheet - Page 7

IC BUFF/DVR TRI-ST DUAL 20DIP

HEF40244BP,652

Manufacturer Part Number
HEF40244BP,652
Description
IC BUFF/DVR TRI-ST DUAL 20DIP
Manufacturer
NXP Semiconductors
Series
4000Br
Datasheets

Specifications of HEF40244BP,652

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
4
Current - Output High, Low
62mA, 45mA
Voltage - Supply
4.5 V ~ 15.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Package / Case
20-DIP (0.300", 7.62mm)
Logic Family
HEF4000
Number Of Channels Per Chip
8
Polarity
Non-Inverting
Supply Voltage (max)
15 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
High Level Output Current
- 19.5 mA
Low Level Output Current
30 mA
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
8 / 8
Output Type
3-State
Propagation Delay Time
190 ns at 5 V, 80 ns at 10 V, 60 ns at 15 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-3089-5
933567170652
HEF40244BPN
Philips Semiconductors
January 1995
SO24: plastic small outline package; 24 leads; body width 7.5 mm
Package information
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT137-1
24
max.
1
2.65
0.10
Z
A
y
pin 1 index
0.012
0.004
0.30
0.10
A
1
0.096
0.089
2.45
2.25
A
2
075E05
IEC
0.25
0.01
A
e
3
D
0.019
0.014
0.49
0.36
b
p
MS-013AD
0.013
0.009
0.32
0.23
JEDEC
c
0
REFERENCES
15.6
15.2
0.61
0.60
D
(1)
b
p
0.30
0.29
E
7.6
7.4
(1)
13
12
w
scale
0.050
EIAJ
1.27
7
5
e
M
10.65
10.00
0.419
0.394
H
c
E
0.055
1.4
A
L
2
10 mm
A
0.043
0.016
1
1.1
0.4
L
p
0.043
0.039
1.1
1.0
Q
H
E
E
detail X
PROJECTION
EUROPEAN
0.25
0.01
v
L
Package outlines
L
p
Q
0.25
0.01
w
(A )
3
0.004
A
0.1
y
A
ISSUE DATE
95-01-24
97-05-22
0.035
0.016
X
Z
0.9
0.4
v
(1)
SOT137-1
M
A
8
0
o
o

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