HS3J Taiwan Semiconductor Company, Ltd. (TSC), HS3J Datasheet

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HS3J

Manufacturer Part Number
HS3J
Description
Manufacturer
Taiwan Semiconductor Company, Ltd. (TSC)
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HS3J
Manufacturer:
TSC
Quantity:
20 000
Features
Mechanical Data
Maximum Ratings and Electrical Characteristics
Rating at 25
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
See Fig. 1
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated Load
(JEDEC method )
Maximum Instantaneous Forward Voltage
@ 3.0A
Maximum DC Reverse Current @ T
at Rated DC Blocking Voltage @ T
Maximum Reverse Recovery Time ( Note 1 )
Typical Junction Capacitance ( Note 2 )
Maximum Thermal Resistance (Note 3)
Operating Temperature Range
Storage Temperature Range
Notes:
Type Number
Glass passivated junction chip.
For surface mounted application
Low forward voltage drop
Low profile package
Built-in stain relief, ideal for automatic
placement
Fast switching for high efficiency
High temperature soldering:
260
Plastic material used carries Underwriters
Laboratory Classification 94V0
Cases: Molded plastic
Terminals:
Polarity: Indicated by cathode band
Packing: 16mm tape per EIA STD RS-481
Weight: 0.21 gram
o
C/10 seconds at terminals
1. Reverse Recovery Test Conditions: I
2. Measured at 1 MHz and Applied V
3. Mounted on P.C.Board with 0.6” x 0.6”(16mm x 16mm) Copper Pad Area.
o
C ambient temperature unless otherwise specified.
Pure tin plated, lead free
A
A
=125
=25
3.0 AMPS. High Efficient Surface Mount Rectifiers
o
o
C
C
Symbol
V
R
V
R
I
V
I
T
FSM
=4.0 Volts.
(AV)
Trr
RRM
V
RMS
Cj
I
θJA
T
STG
F
DC
R
F
J
=0.5A, I
- 278 -
HS
3A
50
35
50
R
=1.0A, I
100
100
HS
3B
70
Dimensions in inches and (millimeters)
1.0
RR
.103(2.62)
.079(2.00)
.063(1.6)
.039(1.0)
.126(3.20)
.114(2.90)
200
140
200
HS
3D
50
80
=0.25A
SMC/DO-214AB
-55 to +150
-55 to +150
300
210
300
HS
3F
150
250
3.0
10
60
400
280
400
1.3
HS
3G
HS3A - HS3M
.280(7.11)
.260(6.60)
.320(8.13)
.305(7.75)
600
420
600
HS
3J
.008(.20)
.004(.10)
800 1000
560
800 1000
1.7
.012(.31)
.006(.15)
HS
3K
75
50
.061(1.56)
.050(1.26)
.245(6.22)
.220(5.59)
700
Version: B07
HS
3M
Units
o
C/W
uA
uA
nS
pF
o
o
V
V
V
A
A
V
C
C

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HS3J Summary of contents

Page 1

Features Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: o 260 C/10 seconds at terminals Plastic material used ...

Page 2

RATINGS AND CHARACTERISTIC CURVES (HS3A THRU HS3M) FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE 3.0 2.5 2.0 1.5 1.0 0 100 AMBIENT TEMPERATURE FIG.3- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 300 200 100 0 1 ...

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