IRFZ24N International Rectifier Corp., IRFZ24N Datasheet

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IRFZ24N

Manufacturer Part Number
IRFZ24N
Description
Manufacturer
International Rectifier Corp.
Datasheet

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Description
l
l
l
l
l
Absolute Maximum Ratings
Thermal Resistance
www.irf.com
Fifth Generation
International Rectifier utilize advanced processing
techniques to achieve the lowest possible on-resistance
per silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that HEXFET
power MOSFETs are well known for, provides the designer
with an extremely efficient device for use in a wide variety
of applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 watts. The low thermal resistance
and low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
HEXFET
I
I
I
P
V
E
I
E
dv/dt
T
T
R
R
R
D
D
DM
AR
STG
D
GS
AS
AR
J
@ T
@ T
JC
CS
JA
Advanced Process Technology
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
@T
C
C
C
= 25°C
= 100°C
= 25°C
®
Power MOSFET
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy ‚
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt ƒ
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw.
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
HEXFET
®
Parameter
Parameter
power MOSFETs
GS
GS
@ 10V
@ 10V
from
G
Min.
––––
––––
––––
300 (1.6mm from case)
10 lbf•in (1.1N•m)
-55 to + 175
S
D
––––
Typ.
––––
0.50
Max.
0.30
±20
TO-220AB
4.5
5.0
17
12
68
45
71
10
IRFZ24N
R
DS(on)
Max.
––––
V
3.3
62
DSS
I
D
PD - 91354A
= 17A
= 0.07
= 55V
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
A
V
A
1
9/13/99

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IRFZ24N Summary of contents

Page 1

... Case-to-Sink, Flat, Greased Surface CS R Junction-to-Ambient JA www.irf.com G from @ 10V GS @ 10V GS 300 (1.6mm from case) 10 lbf•in (1.1N•m) Min. –––– –––– –––– 91354A IRFZ24N 55V DSS R = 0.07 DS(on 17A D S TO-220AB Max. Units ...

Page 2

... IRFZ24N Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge ...

Page 3

... ate-to -So urce Voltag e ( Fig 3. Typical Transfer Characteristics www.irf.com ° IRFZ24N VGS TOP 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4. .5V 2 0µ 5° 0.1 ...

Page 4

... IRFZ24N iss oss rss rain-to-S ourc e V oltage ( Fig 5. Typical Capacitance Vs. ...

Page 5

... Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com Fig 10a. Switching Time Test Circuit V 90 10% V Fig 10b. Switching Time Waveforms 0.001 ectang ular P ulse D uration (sec) 1 IRFZ24N D.U. 10V Pulse Width µs Duty Factor DS ...

Page 6

... IRFZ24N V DS D.U. Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform 0.01 V (BR)DSS V DD ...

Page 7

... Low Leakage Inductance Current Transformer - - dv/dt controlled Driver same type as D.U.T. I controlled by Duty Factor "D" SD D.U.T. - Device Under Test Period D = P.W. Waveform SD Body Diode Forward Current di/dt Waveform DS Diode Recovery dv/dt Body Diode Forward Drop Ripple 5% ® power MOSFETs IRFZ24N „ P.W. Period V =10V * ...

Page 8

... IRFZ24N Package Outline TO-220AB Dimensions are shown in millimeters (inches) 2.87 (.11 3) 2.62 (. 5.24 (. 4.84 (. 4.09 (. 3. 2.54 (. & ING 4. 82. ...

Page 9

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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