MC14050BDG ON Semiconductor, MC14050BDG Datasheet

IC BUFFER HEX NON-INVERT 16SOIC

MC14050BDG

Manufacturer Part Number
MC14050BDG
Description
IC BUFFER HEX NON-INVERT 16SOIC
Manufacturer
ON Semiconductor
Series
4000Br
Datasheet

Specifications of MC14050BDG

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
6
Number Of Bits Per Element
1
Current - Output High, Low
10mA, 40mA
Voltage - Supply
3 V ~ 18 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (3.9mm Width)
Logic Family
MC140
Number Of Channels Per Chip
Hex
Polarity
Non-Inverting
Supply Voltage (max)
18 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 4.7 mA (Min)
Input Bias Current (max)
4 uA
Low Level Output Current
30 mA (Min)
Minimum Operating Temperature
- 55 C
Propagation Delay Time
140 ns @ 5 V or 80 ns @ 10 V or 60 ns @ 15 V
Number Of Lines (input / Output)
6 / 6
Logic Device Type
Buffer, Non Inverting
Supply Voltage Range
3V To 18V
Logic Case Style
SOIC
No. Of Pins
16
Operating Temperature Range
-55°C To +125°C
Filter Terminals
SMD
Rohs Compliant
Yes
Family Type
4000 CMOS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC14050BDG
MC14050BDGOS
MC14049B, MC14050B
Hex Buffer
Hex Buffer are constructed with MOS P−Channel and N−Channel
enhancement mode devices in a single monolithic structure. These
complementary MOS devices find primary use where low power
dissipation and/or high noise immunity is desired. These devices
provide logic level conversion using only one supply voltage, V
voltage for logic level conversions. Two TTL/DTL loads can be driven
when the devices are used as a CMOS−to−TTL/DTL converter
(V
devices; consequently connections to these terminals will not affect
circuit operation.
Features
1. Temperature Derating: See Figure 3.
due to high static voltages or electric fields referenced to the V
precautions must be taken to avoid applications of any voltage higher than the
maximum rated voltages to this high−impedance circuit. For proper operation, the
ranges V
(e.g., either V
*For additional information on our Pb−Free strategy and soldering details, please
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 6
Symbol
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
The MC14049B Hex Inverter/Buffer and MC14050B Noninverting
The input−signal high level (V
Note that pins 13 and 16 are not connected internally on these
This device contains protection circuitry to protect the inputs against damage
Unused inputs must always be tied to an appropriate logic voltage level
DD
High Source and Sink Currents
High−to−Low Level Converter
Supply Voltage Range = 3.0 V to 18 V
V
Meets JEDEC B Specifications
Improved ESD Protection On All Inputs
Pb−Free Packages are Available*
V
V
T
I
V
P
T
T
I
out
stg
DD
out
IN
in
in
D
A
L
= 5.0 V, V
can exceed V
SS
DC Supply Voltage Range
Input Voltage Range (DC or Transient)
Output Voltage Range (DC or Transient)
Input Current (DC or Transient) per Pin
Output Current (DC or Transient) per Pin
Power Dissipation, per Package (Note 1)
(Plastic)
(SOIC)
Ambient Temperature Range
Storage Temperature Range
Lead Temperature (8−Second Soldering)
≤ V
SS
in
or V
≤ 18 V and V
OL
DD
v 0.4 V, I
DD
). Unused outputs must be left open.
(Voltages Referenced to V
Parameter
SS
≤ V
OL
out
≥ 3.2 mA).
IH
≤ V
) can exceed the V
DD
are recommended.
SS
)
−0.5 to +18.0
−0.5 to +18.0
−0.5 to V
−55 to +125
−65 to +150
Value
± 10
± 45
825
740
260
0.5
SS
DD
pin only. Extra
DD
+
1
supply
Unit
DD
mW
mA
mA
°C
°C
°C
V
V
V
.
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
xx
A
WL, L
YY, Y
WW, W
G
http://onsemi.com
CASE 751B
CASE 948F
SOEIAJ−16
TSSOP−16
DT SUFFIX
CASE 648
CASE 966
P SUFFIX
D SUFFIX
F SUFFIX
SOIC−16
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Indicator
PDIP−16
Publication Order Number:
16
1
16
16
1
1
DIAGRAMS
16
MC140xxBCPG
MARKING
1
MC140xxB
AWLYYWW
AWLYWW
MC14049B/D
140xxBG
ALYWG
ALYW
0xxB
14

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MC14050BDG Summary of contents

Page 1

... Unused inputs must always be tied to an appropriate logic voltage level (e.g., either Unused outputs must be left open *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005 August, 2005 − Rev can exceed the V ...

Page 2

PIN ASSIGNMENT OUT 2 15 OUT OUT OUT B E OUT OUT ...

Page 3

ELECTRICAL CHARACTERISTICS Î Î Î Î Î ...

Page 4

AC SWITCHING CHARACTERISTICS (Note 5) Î Î ...

Page 5

Figure 3. Ambient Temperature Power Derating PULSE GENERATOR Invert on MC14049B only Figure 4. ...

Page 6

0.25 (0.010) M −A− −B− −T− SEATING PLANE 0.25 (0.010 MC14049B, MC14050B PACKAGE ...

Page 7

K 16X REF 0.10 (0.004) 0.15 (0.006 L PIN 1 IDENT. 1 0.15 (0.006 −V− C 0.10 (0.004) SEATING −T− PLANE D MC14049B, MC14050B PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX PLASTIC ...

Page 8

... DETAIL P VIEW American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. ...

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