MC14050BDG ON Semiconductor, MC14050BDG Datasheet - Page 8

IC BUFFER HEX NON-INVERT 16SOIC

MC14050BDG

Manufacturer Part Number
MC14050BDG
Description
IC BUFFER HEX NON-INVERT 16SOIC
Manufacturer
ON Semiconductor
Series
4000Br
Datasheet

Specifications of MC14050BDG

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
6
Number Of Bits Per Element
1
Current - Output High, Low
10mA, 40mA
Voltage - Supply
3 V ~ 18 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (3.9mm Width)
Logic Family
MC140
Number Of Channels Per Chip
Hex
Polarity
Non-Inverting
Supply Voltage (max)
18 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 4.7 mA (Min)
Input Bias Current (max)
4 uA
Low Level Output Current
30 mA (Min)
Minimum Operating Temperature
- 55 C
Propagation Delay Time
140 ns @ 5 V or 80 ns @ 10 V or 60 ns @ 15 V
Number Of Lines (input / Output)
6 / 6
Logic Device Type
Buffer, Non Inverting
Supply Voltage Range
3V To 18V
Logic Case Style
SOIC
No. Of Pins
16
Operating Temperature Range
-55°C To +125°C
Filter Terminals
SMD
Rohs Compliant
Yes
Family Type
4000 CMOS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC14050BDG
MC14050BDGOS
PUBLICATION ORDERING INFORMATION
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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e
16
1
0.13 (0.005)
Z
b
D
M
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
9
8
A
E
0.10 (0.004)
A
H
1
E
VIEW P
PLASTIC EIAJ SOIC PACKAGE
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
MC14049B, MC14050B
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
M
_
L
http://onsemi.com
E
CASE 966−01
SOEIAJ−16
F SUFFIX
ISSUE O
L
DETAIL P
8
Q
1
c
NOTES:
1.
2.
3.
4.
5.
Y14.5M, 1982.
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
M
A
b
c
D
E
e
L
L
Q
Z
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
E
1
E
DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE
TERMINAL NUMBERS ARE SHOWN FOR
THE LEAD WIDTH DIMENSION (b) DOES NOT
1
MILLIMETERS
MIN
0.05
0.35
0.18
9.90
5.10
7.40
0.50
0.70
1.10
−−−
−−−
0
1.27 BSC
_
10.50
MAX
10
2.05
0.20
0.50
0.27
5.45
8.20
0.85
1.50
0.90
0.78
_
0.002
0.014
0.007
0.390
0.201
0.291
0.020
0.043
0.028
MIN
−−−
−−−
0
0.050 BSC
INCHES
_
MC14049B/D
0.081
0.008
0.020
0.413
0.215
0.323
0.033
0.059
0.035
0.031
MAX
0.011
10
_

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