PIC16F688

Manufacturer Part NumberPIC16F688
ManufacturerMicrochip Technology Inc.
PIC16F688 datasheet
 


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Page 153/202:

Thermal Considerations

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14.6

Thermal Considerations

Standard Operating Conditions (unless otherwise stated)
-40°C ≤ T
Operating temperature
A
Param
Sym
Characteristic
No.
θ
TH01
Thermal Resistance
JA
Junction to Ambient
θ
TH02
Thermal Resistance
JC
Junction to Case
TH03
T
Junction Temperature
J
TH04
PD
Power Dissipation
TH05
P
Internal Power Dissipation
INTERNAL
TH06
P
/
I/O Power Dissipation
I
O
TH07
P
Derated Power
DER
Note 1:
I
is current to run the chip alone without driving any load on the output pins.
DD
2:
T
= Ambient Temperature.
A
3:
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
© 2007 Microchip Technology Inc.
≤ +125°C
Typ
Units
69.8
C/W
85.0
C/W
100.4
C/W
46.3
C/W
32.5
C/W
31.0
C/W
31.7
C/W
2.6
C/W
150
C
W
W
W
W
).
DER
PIC16F688
Conditions
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP package
16-pin QFN 4x0.9mm package
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP package
16-pin QFN 4x0.9mm package
For derated power calculations
PD = P
+ P
/
INTERNAL
I
O
P
= I
x V
INTERNAL
DD
DD
(NOTE 1)
= Σ (I
) + Σ (I
P
/
* V
* (V
- V
I
O
OL
OL
OH
DD
OH
P
= (T
- T
)/θ
DER
J
A
JA
(NOTE 2, 3)
DS41203D-page 151
))