PIC16F688

Manufacturer Part NumberPIC16F688
ManufacturerMicrochip Technology Inc.
PIC16F688 datasheet
 
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Page 188/202:

Package Details

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PIC16F688
16.2

Package Details

The following sections give the technical details of the
packages.
14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
3
1
2
A
A1
b1
b
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
DS41203D-page 186
E1
D
A2
L
e
Units
INCHES
Dimension Limits
MIN
N
e
.100 BSC
A
A2
.115
A1
.015
E
.290
E1
.240
D
.735
L
.115
c
.008
b1
.045
b
.014
eB
E
c
eB
NOM
MAX
14
.210
.130
.195
.310
.325
.250
.280
.750
.775
.130
.150
.010
.015
.060
.070
.018
.022
.430
Microchip Technology Drawing C04-005B
© 2007 Microchip Technology Inc.