PIC16F688

Manufacturer Part NumberPIC16F688
ManufacturerMicrochip Technology Inc.
PIC16F688 datasheet
 


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PIC16F688
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
NOTE 1
1 2
b
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
DS41203D-page 188
E
E1
e
c
A2
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
N
14
e
0.65 BSC
A
A2
0.80
1.00
A1
0.05
E
6.40 BSC
E1
4.30
4.40
D
4.90
5.00
L
0.45
0.60
L1
1.00 REF
φ
c
0.09
b
0.19
Microchip Technology Drawing C04-087B
φ
L
MAX
1.20
1.05
0.15
4.50
5.10
0.75
0.20
0.30
© 2007 Microchip Technology Inc.