PIC16F88

Manufacturer Part NumberPIC16F88
ManufacturerMicrochip Technology Inc.
PIC16F88 datasheet
 
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18-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
E
p
E1
B
n
h
45
c
Dimension Limits
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
 2005 Microchip Technology Inc.
D
2
1
A
L
A1
Units
INCHES*
MIN
NOM
MAX
n
18
p
.050
A
.093
.099
.104
A2
.088
.091
.094
A1
.004
.008
.012
E
.394
.407
.420
E1
.291
.295
.299
D
.446
.454
.462
h
.010
.020
.029
L
.016
.033
.050
0
4
8
c
.009
.011
.012
B
.014
.017
.020
0
12
15
0
12
15
PIC16F87/88
A2
MILLIMETERS
MIN
NOM
MAX
18
1.27
2.36
2.50
2.64
2.24
2.31
2.39
0.10
0.20
0.30
10.01
10.34
10.67
7.39
7.49
7.59
11.33
11.53
11.73
0.25
0.50
0.74
0.41
0.84
1.27
0
4
8
0.23
0.27
0.30
0.36
0.42
0.51
0
12
15
0
12
15
DS30487C-page 209