74LVT16244MTD Fairchild Semiconductor, 74LVT16244MTD Datasheet

IC BUFF DVR TRI-ST 16BIT 48TSSOP

74LVT16244MTD

Manufacturer Part Number
74LVT16244MTD
Description
IC BUFF DVR TRI-ST 16BIT 48TSSOP
Manufacturer
Fairchild Semiconductor
Series
74LVTr
Datasheet

Specifications of 74LVT16244MTD

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
4
Number Of Bits Per Element
4
Current - Output High, Low
32mA, 64mA
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
48-TSSOP
Logic Device Type
Buffer, Non Inverting
Supply Voltage Range
2.7V To 3.6V
Logic Case Style
TSSOP
No. Of Pins
48
Operating Temperature Range
-65°C To +150°C
Svhc
No SVHC (15-Dec-2010)
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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© 2005 Fairchild Semiconductor Corporation
74LVT16244G
(Note 1)(Note 2)
74LVT16244MEA
(Note 2)
74LVT16244MTD
(Note 2)
74LVTH16244G
(Note 1)(Note 2)
74LVTH16244MEA
(Note 2)
74LVTH16244MTD
(Note 2)
74LVT16244 • 74LVTH16244
Low Voltage16-Bit Buffer/Line Driver
with 3-STATE Outputs
General Description
The LVT16244 and LVTH16244 contain sixteen non-invert-
ing buffers with 3-STATE outputs designed to be employed
as a memory and address driver, clock driver, or bus ori-
ented transmitter/receiver. The device is nibble controlled.
Individual 3-STATE control inputs can be shorted together
for 8-bit or 16-bit operation.
The LVTH16244 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These buffers and line drivers are designed for low-voltage
(3.3V) V
TTL interface to a 5V environment. The LVT16244 and
LVTH16244 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining a low power dissipation
Ordering Code:
Note 1: Ordering code “G” indicates Trays.
Note 2: Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
Order Number
CC
applications, but with the capability to provide a
(Preliminary)
Package
Number
BGA54A
BGA54A
MS48A
MTD48
MS48A
MTD48
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
DS500151
Features
Input and output interface capability to systems at
5V V
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH16244),
also available without bushold feature (74LVT16244).
Live insertion/extraction permitted
Power Up/Down high impedance provides glitch-free
bus loading
Outputs source/sink
Functionally compatible with the 74 series 16244
Latch-up performance exceeds 500 mA
ESD performance:
Human-body model
Machine model
Charged-drive model
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
CC
Package Description
!
200V
!

2000V
32 mA/
!
1000V
March 1999
Revised June 2005

64 mA
www.fairchildsemi.com

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74LVT16244MTD Summary of contents

Page 1

... MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide (Note 2) 74LVT16244MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) 74LVTH16244G BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide ...

Page 2

Connection Diagrams Pin Assignment for SSOP and TSSOP Pin Assignment for FBGA (Top Thru View) Logic Diagram www.fairchildsemi.com Pin Descriptions Pin Names Description OE Output Enable Inputs (Active LOW –I Inputs –O Outputs 0 15 ...

Page 3

Absolute Maximum Ratings Symbol Parameter V Supply Voltage Input Voltage I V Output Voltage Input Diode Current Output Diode Current Output Current Supply Current per ...

Page 4

DC Electrical Characteristics Symbol Parameter I Power Supply Current CCH I Power Supply Current CCL I Power Supply Current CCZ  I Power Supply Current CCZ ' I Increase in Power Supply Current CC (Note 8) Note 5: Applies to ...

Page 5

Physical Dimensions inches (millimeters) unless otherwise noted 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide Package Number BGA54A 5 www.fairchildsemi.com ...

Page 6

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide www.fairchildsemi.com Package Number MS48A 6 ...

Page 7

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves ...

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