74HC3G34DP,125 NXP Semiconductors, 74HC3G34DP,125 Datasheet
74HC3G34DP,125
Specifications of 74HC3G34DP,125
74HC3G34DP-G
935272146125
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74HC3G34DP,125 Summary of contents
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Triple buffer gate Rev. 05 — 7 May 2009 1. General description The 74HC3G34; 74HCT3G34 are high-speed Si-gate CMOS devices. They provide three buffer gates. The HC device has CMOS input switching levels and supply voltage range 2 ...
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... NXP Semiconductors 4. Marking Table 2. Marking Type number 74HC3G34DP 74HCT3G34DP 74HC3G34DC 74HCT3G34DC 74HC3G34GD 74HCT3G34GD 5. Functional diagram mna744 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning 74HC3G34 74HCT3G34 GND 001aae470 Fig 3. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) 74HC_HCT3G34_5 Product data sheet Marking code ...
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... NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin 1A, 2A 1Y, 2Y GND Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V) ...
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... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter 74HCT3G34 V HIGH-level input IH voltage V LOW-level input IL voltage V HIGH-level output OH voltage V LOW-level output OL voltage I input leakage current I I supply current CC I additional supply CC current C input capacitance I [1] All typical values are measured ...
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... NXP Semiconductors Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions 74HCT3G34 t propagation delay nA to nY; see transition time nY power dissipation V = GND capacitance [1] All typical values are measured the same as t and PLH PHL ...
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... NXP Semiconductors negative positive Test data is given in Table Definitions for test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 6. Test circuit for measuring switching times Table 10. Test data Type ...
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... NXP Semiconductors 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.35 2.1 mm 0.5 0.00 0.15 1.9 OUTLINE VERSION IEC SOT996 Fig 9. Package outline SOT996-2 (XSON8U) ...
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... Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Added type number 74HC3G34GD and 74HCT3G34GD (XSON8U package) ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 Abbreviations ...