IC TRANSCVR TRI-ST 8BIT 20TSSOP

74ABT623PW,112

Manufacturer Part Number74ABT623PW,112
DescriptionIC TRANSCVR TRI-ST 8BIT 20TSSOP
ManufacturerNXP Semiconductors
Series74ABT
74ABT623PW,112 datasheet
 

Specifications of 74ABT623PW,112

Logic TypeTransceiver, Non-InvertingNumber Of Elements1
Number Of Bits Per Element8Current - Output High, Low32mA, 64mA
Voltage - Supply4.5 V ~ 5.5 VOperating Temperature-40°C ~ 85°C
Mounting TypeSurface MountPackage / Case20-TSSOP
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names74ABT623PW
74ABT623PW
935180400112
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74ABT623
Octal transceiver with dual enable; non-inverting; 3-state
Rev. 03 — 22 October 2009
1. General description
The 74ABT623 high performance BiCMOS device combines low static and dynamic
power dissipation with high speed and high output drive.
The 74ABT623 is an octal transceiver featuring non-inverting 3-state bus compatible
outputs in both send and receive directions. This octal bus transceiver is designed for
asynchronous two-way communication between data buses.
The control function implementation allows maximum flexibility in timing. This device
allows data transmission from the A bus to the B bus or from the B bus to the A bus,
depending upon the logic levels at the enable inputs (pins OEAB and OEBA). The enable
inputs can be used to disable the device so that the buses are effectively isolated. The
dual enable function configuration gives this transceiver the capability to store data by
simultaneous enabling of pins OEAB and OEBA. Each output reinforces its input in this
transceiver configuration. Thus, when both control inputs are enabled and all other data
sources to the two sets of the bus lines are at high-impedance OFF-state, both sets of the
bus lines will remain at their last states. The 8-bit codes appearing on the two sets of
buses will be identical.
2. Features
I
Octal bidirectional bus interface
I
3-state buffers
I
Power-up 3-state
I
Output capability: +64 mA and 32 mA
I
data inputs are disabled during 3-state mode
I
Latch-up protection exceeds 500 mA per JESD78B class II level A
I
ESD protection:
N
HBM JESD22-A114F exceeds 2000 V
N
MM JESD22-A115-A exceeds 200 V
Product data sheet

74ABT623PW,112 Summary of contents

  • Page 1

    Octal transceiver with dual enable; non-inverting; 3-state Rev. 03 — 22 October 2009 1. General description The 74ABT623 high performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ABT623 is ...

  • Page 2

    ... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 74ABT623D +85 C 74ABT623DB +85 C 74ABT623PW + Functional diagram 1 OEAB 001aaa844 Fig 1. Logic symbol. 74ABT623_3 Product data sheet Octal transceiver with dual enable; non-inverting; 3-state Description SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 SSOP20 plastic shrink small outline package ...

  • Page 3

    ... NXP Semiconductors Fig 3. Logic diagram 74ABT623_3 Product data sheet Octal transceiver with dual enable; non-inverting; 3-state 001aaa832 Rev. 03 — 22 October 2009 74ABT623 © NXP B.V. 2009. All rights reserved ...

  • Page 4

    ... NXP Semiconductors 5. Pinning information 5.1 Pinning 74ABT623 OEAB GND 10 001aak828 Fig 4. Pin configuration SO20 5.2 Pin description Table 2. Pin description Symbol Pin OEAB 18, 17, 16, 15, 14, 13, 12, 11 GND 10 OEBA Functional description [1] Table 3. Function table Input OEAB OEBA [ HIGH voltage level LOW voltage level high-impedance OFF-state. ...

  • Page 5

    ... NXP Semiconductors 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V input voltage I V output voltage O I input diode current IK I output diode current OK I output current O T junction temperature j T storage temperature ...

  • Page 6

    ... NXP Semiconductors 9. Static characteristics Table 6. Static characteristics Symbol Parameter V input clamping voltage HIGH-level output OH voltage V LOW-level output OL voltage I input leakage current I I power-off leakage OFF current I power-up/power-down O(pu/pd) output current I OFF-state output OZ current I output leakage current HIGH-state output current O I supply current ...

  • Page 7

    ... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; for test circuit, see Figure Symbol Parameter Conditions t LOW to HIGH An; see PLH propagation delay t HIGH to LOW An; see PHL propagation delay t OFF-state to HIGH OEAB, OEBA Bn; see PZH propagation delay and t OFF-state to LOW OEAB, OEBA Bn; see ...

  • Page 8

    ... NXP Semiconductors OEAB input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 7. Enable and disable times for OEAB input. OEBA input output LOW-to-OFF OFF-to-LOW output ...

  • Page 9

    ... NXP Semiconductors negative V M pulse positive V M pulse Input pulse definition Test data and V levels are given in EXT C = Load capacitance including jig and probe capacitance. L Fig 9. Test circuit for measuring switching times Table 9. Test data Input Load 2 74ABT623_3 Product data sheet Octal transceiver with dual enable ...

  • Page 10

    ... NXP Semiconductors 12. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 2.65 mm 0.25 0.1 2.25 0.012 0.096 0.1 inches 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...

  • Page 11

    ... NXP Semiconductors SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT339-1 Fig 11. Package outline SOT339-1. ...

  • Page 12

    ... NXP Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...

  • Page 13

    ... Release date 74ABT623_3 20091022 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • DIP20 package removed from outline”. ...

  • Page 14

    ... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

  • Page 15

    ... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14 Revision history ...