NL27WZ126USG ON Semiconductor, NL27WZ126USG Datasheet - Page 6

• Manufacturer Part Number: NL27WZ126USG
• Description: IC BUFFER DL TRI-ST NON-INV US8
• Manufacturer: ON Semiconductor
• Series: 27WZr

Specifications of NL27WZ126USG

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 2
• Number Of Bits Per Element: 1
• Current - Output High, Low: 32mA, 32mA
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: US8, 8-VSSOP
• Logic Family: LCX
• Number Of Channels Per Chip: 2
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 32 mA
• Low Level Output Current: 32 mA
• Maximum Power Dissipation: 250 mW
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 2 / 3
• Output Type: 3-State
• Propagation Delay Time: 5.7 ns at 3.3 V, 5 ns at 5 V
• Logic Device Type: Buffer, Non Inverting
• Supply Voltage Range: 1.65V To 5.5V
• Logic Case Style: US8
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +85°C
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Family Type: 27WZ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NL27WZ126USGOS; NL27WZ126USGOS; NL27WZ126USGOSTR

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SEATING
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
5
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0.0197
0.50
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
0.10 (0.004)
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
R
V
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
J
T
U
DETAIL E
http://onsemi.com
S
NL27WZ126
CASE 493−02
US SUFFIX
0.0394
ISSUE B
1.0
US8
DETAIL E
0.15
0.07
3.8
6
1.8
N
H
F
SCALE 8:1
R 0.10 TYP
M
inches
0.012
mm
0.30
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
4. DIMENSION “B” DOES NOT INCLUDE
5. LEAD FINISH IS SOLDER PLATING WITH
6. ALL TOLERANCE UNLESS OTHERWISE
ANSI Y14.5M, 1982.
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
SPECIFIED ±0.0508 (0.0002 “).
DIM
M
A
B
C
D
F
G
H
K
L
N
P
R
S
U
V
J
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MILLIMETERS
MIN
1.90
2.20
0.60
0.17
0.20
0.10
0.00
3.00
0.23
0.23
0.37
0.60
0.50 BSC
0.40 REF
0.12 BSC
0
5
_
_
MAX
2.10
2.40
0.90
0.25
0.35
0.18
0.10
3.20
0.34
0.33
0.47
0.80
10
6
_
_
0.075
0.087
0.024
0.007
0.008
0.004
0.000
0.010
0.009
0.015
0.024
0.118
MIN
0.020 BSC
0.016 REF
0.005 BSC
0
5
NL27WZ126/D
INCHES
_
_
0.083
0.094
0.035
0.010
0.014
0.007
0.004
0.126
0.013
0.013
0.019
0.031
MAX
10
6
_
_