HVL358CM Renesas Electronics Corporation., HVL358CM Datasheet
HVL358CM
Related parts for HVL358CM
HVL358CM Summary of contents
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... Variable Capacitance Diode for VCO Features High capacitance ratio 2.20 min) Low series resistance. (rs = 0.40 Good C-V linearity Thin Extremely small Flat Lead Package (TEFP) is suitable for surface mount design. Ordering Information Type No. HVL358CM Pin Arrangement Rev.4.00 Mar 10, 2006 page max) Laser Mark Package Name 8 TEFP ...
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... HVL358CM Absolute Maximum Ratings Item Reverse voltage Junction temperature Storage temperature Electrical Characteristics Item Symbol Reverse current Capacitance Capacitance ratio n Series resistance r S Note For TEFP package, the material of lead is exposed for cutting plane. There for, soldering nature of lead tip part is considered as unquestioned ...
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... HVL358CM Main Characteristic Reverse voltage V Fig.1 Reverse current vs. Reverse voltage 0.4 0.3 0.2 0.1 0 0.1 1.0 Reverse voltage V Fig.3 Series resistance vs. Reverse voltage Rev.4.00 Mar 10, 2006 page 0.1 (V) R Fig.2 Capacitance vs. Reverse Voltage f=470MHz 10 (V) R f=1MHz 1.0 10 Reverse voltage V (V) R ...
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... HVL358CM Package Dimensions Package Name JEITA Package Code RENESAS Code TEFP PUSF0002ZA Rev.4.00 Mar 10, 2006 page Previous Code MASS[Typ.] TEFP / TEFPV 0.0006g Pattern of terminal position areas e 1 Dimension in Millimeters Reference Symbol Min 0.08 D 0.55 0. ...
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Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead ...