CMS07 TOSHIBA Semiconductor CORPORATION, CMS07 Datasheet
CMS07
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CMS07 Summary of contents
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... R th (j-ℓ JEDEC ― A JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) Min Typ. Max ⎯ ⎯ 0.35 ⎯ 0.38 ⎯ 0.41 0.45 ⎯ ⎯ 3.0 ⎯ 30.0 500 ⎯ ⎯ 130 ⎯ ⎯ 60 ⎯ ⎯ 135 ⎯ ⎯ 16 2006-11-13 CMS07 Unit: mm Unit V μA pF °C/W °C/W ...
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... Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. Unit: mm 1.4 has a temperature coefficient of 0.1%/°C. Take RRM curve. F(AV) of below 120° CMS07 2006-11-13 ...
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... Average forward current I r – (j-a) Device mounted on a glass-epoxy board Soldering land: 6.0 mm × 6.0 mm Device mounted on a ceramic board Soldering land: 2.0 mm × 2 Time t (s) 3 CMS07 P – (AV) F (AV) DC α = 180° α = 120° α = 60° Rectangular waveform 0° α 360° ...
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... Rectangular waveform 1.4 360° 0° 1 α 1.0 Conduction angle: α 150°C 0.8 0.6 0.4 0.2 0 140 160 0 4 CMS07 C – V (typ MHz Ta = 25°C 10 100 Reverse voltage V ( – V (typ.) R (AV 300° 240° 180° 120° ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 CMS07 20070701-EN 2006-11-13 ...