CMF01 TOSHIBA Semiconductor CORPORATION, CMF01 Datasheet

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CMF01

Manufacturer Part Number
CMF01
Description
Toshiba Fast Recovery Diode Silicon Diffused Type
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet

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Switching Mode Power Supply Applications
DC/DC Converter Applications
Absolute Maximum Ratings
Repetitive peak reverse voltage: V
Average forward current: I
Forward voltage: V
Very fast reverse-recovery time: t
Suitable for compact assembly due to small surface-mount package
“M−FLAT
Repetitive peak reverse voltage
Average forward current
Peak one-cycle surge forward current
(non-repetitive)
Junction temperature
Storage temperature range
Note 1: Tℓ =100°C
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
Device mounted on a ceramic board
Board size: 50 mm × 50 mm,
Soldering land size: 2 mm × 2 mm
Board thickness: 0.64 t
Rectangular waveform (α = 180°)
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
TM
Characteristic
” (Toshiba package name)
FM
= 2.0 V (max)
TOSHIBA Fast Recovery Diode Silicon Diffused Type
F (AV)
= 2.0 A
rr
RRM
(Ta = 25°C)
= 100 ns (max.)
Symbol
I
V
F (AV)
I
T
FSM
RRM
T
= 600 V
stg
j
CMF01
2.0 (Note 1)
30 (50 Hz)
−40~150
−40~150
Rating
600
1
Unit
°C
°C
V
A
A
Weight: 0.023 g (typ.)
JEDEC
JEITA
TOSHIBA
3-4E1A
2006-11-07
CMF01
Unit: mm

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CMF01 Summary of contents

Page 1

... CMF01 = 600 V RRM = 2 100 ns (max.) rr (Ta = 25°C) Symbol Rating Unit V 600 V RRM I 2.0 (Note (AV (50 Hz) A FSM −40~150 T °C j −40~150 T °C stg 1 CMF01 Unit: mm ⎯ JEDEC ⎯ JEITA TOSHIBA 3-4E1A Weight: 0.023 g (typ.) 2006-11-07 ...

Page 2

... R th (j-a) (soldering land × 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size × 50 mm) (soldering land: 2.1 mm × 1.4 mm) (board thickness: 1.6 t) ⎯ (j-ℓ) Standard Soldering Pad 1.4 2 CMF01 Min Typ. Max ⎯ 1.4 2.0 ⎯ ⎯ 50 ⎯ ⎯ 100 ⎯ ⎯ ...

Page 3

... Average forward current I 1000 Device mounted on a glass-epoxy board (board size × 50 mm, land size: 2.1 mm × 1.4 mm, board thickness: 1.6 t) 100 10 1 0.001 0.01 100 3 CMF01 P – (AV) F (AV) 180° Rectangular 120° waveform α 0° 360° Conduction angle α 0.8 1.2 1.6 2.0 2.4 2.8 ...

Page 4

... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 4 CMF01 20070701-EN 2006-11-07 ...

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