CMF04 TOSHIBA Semiconductor CORPORATION, CMF04 Datasheet
CMF04
Available stocks
Related parts for CMF04
CMF04 Summary of contents
Page 1
... Symbol Rating V 800 RRM I 0.5 (Note 1) F (AV (50 Hz) FSM −40 to 150 T j −40 to 150 T stg 1 ② ① 1.75 ± 0.1 Unit + 0.2 − 0.1 2 °C ⎯ JEDEC °C ⎯ JEITA TOSHIBA 3-4E1A Weight: 0.023 g (typ.) 2008-05-13 CMF04 Unit: mm 0.16 ① ANODE ② CATHODE ...
Page 2
... Device mounted on a glass-epoxy board (board size × 50 mm) (soldering land: 2.1 mm × 1.4 mm) (board thickness: 1.6 mm) ⎯ (j-ℓ) Standard Soldering Pad 1.4 curve. of below 120℃ under the worst load and heat radiation conditions. 2 CMF04 Min Typ. Max ⎯ ⎯ 2.5 ⎯ ⎯ 50 ⎯ ⎯ 100 ⎯ ...
Page 3
... Device mounted on a ceramic board (board size × 50 mm, land size × 2 mm, board thickness: 0.64 ｍｍ 100 0.001 0.01 3 CMF04 P – (AV) F (AV) 180° 120° α = 60° Rectangular waveform α 0° 360° ...
Page 4
... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 4 CMF04 20070701-EN GENERAL 2008-05-13 ...