IRF7530 International Rectifier Corp., IRF7530 Datasheet

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IRF7530

Manufacturer Part Number
IRF7530
Description
Hexfetpower Mosfet
Manufacturer
International Rectifier Corp.
Datasheet

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Description
Thermal Resistance
l
l
l
l
l
l
New trench HEXFET
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design that HEXFET
Power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a wide
variety of applications.
The new Micro8 package has half the footprint area of the
standard SO-8. This makes the Micro8 an ideal device for
applications where printed circuit board space is at a premium.
The low profile (<1.1mm) of the Micro8 will allow it to fit easily
into extremely thin application environments such as portable
electronics and PCMCIA cards.
www.irf.com
V
I
I
I
P
P
E
V
T
R
D
D
DM
Trench Technology
Low Profile (<1.1mm)
J,
Dual N-Channel MOSFET
Very Small SOIC Package
DS
D
D
AS
GS
Ultra Low On-Resistance
θJA
@ T
@ T
Available in Tape & Reel
@T
@T
T
STG
A
A
A
A
= 70°C
= 25°C
= 25°C
= 70°C
Drain- Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation
Power Dissipation
Linear Derating Factor
Single Pulse Avalanche Energy„
Gate-to-Source Voltage
Junction and Storage Temperature Range
Maximum Junction-to-Ambient
power MOSFETs from International
Parameter
Parameter
GS
GS
ƒ
@ 4.5V
@ 4.5V
G2
G1
S2
S1
1
2
3
4
Top View
HEXFET
8
7
6
5
-55 to + 150
Max.
Max.
100
0.80
± 12
D1
5.4
4.3
1.3
D1
D2
D2
20
40
10
33
Micro8
®
R
DS(on)
Power MOSFET
V
DSS
= 0.030Ω
= 20V
PD-93760C
mW/°C
Units
Units
°C/W
4/12/04
mJ
°C
V
A
V
1

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IRF7530 Summary of contents

Page 1

Trench Technology l Ultra Low On-Resistance l Dual N-Channel MOSFET l Very Small SOIC Package l Low Profile (<1.1mm) l Available in Tape & Reel l Description  New trench HEXFET power MOSFETs from International Rectifier utilize advanced processing techniques ...

Page 2

Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS ∆V Breakdown Voltage Temp. Coefficient /∆T (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage ...

Page 3

VGS TOP 7.00V 5.00V 4.50V 3.50V 3.00V 2.70V 2.50V BOTTOM 2.25V 2.25V 20µs PULSE WIDTH 0 Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 100 ...

Page 4

1MHz iss rss 1600 oss iss 1200 800 400 C oss C ...

Page 5

T , Case Temperature ( C) C Fig 9. Maximum Drain Current Vs. Case Temperature 1000 100 D = 0.50 0.20 0.10 10 0.05 0.02 0.01 1 SINGLE PULSE (THERMAL ...

Page 6

Id = 5.0A 0.02 0.01 2.0 3.0 4.0 5.0 V GS, Gate -to -Source Voltage ( V ) Fig 12. On-Resistance Vs. Gate Voltage 6 0.10 0.08 0.06 0.04 0. 6.0 7.0 I Fig 13. On-Resistance ...

Page 7

Micro8 Package Outline Dimensions are shown in millimeters (inches 0.25 (.010 ...

Page 8

Micro8 Tape & Reel Information Dimensions are shown in millimeters (inches) 8.1 ( .318 ) 7.9 ( .312 ) NOTES: 1. OUTLINE CONFORMS TO EIA-481 & EIA-541. 2. CONTROLLING DIMENSION : MILLIMETER. NOTES : 1. CONTROLLING DIMENSION : MILLIMETER. 2. ...

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