HD151TS304ARP Renesas Electronics Corporation., HD151TS304ARP Datasheet

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HD151TS304ARP

Manufacturer Part Number
HD151TS304ARP
Description
Assp>ics For Audio Accessory>karaoke Processors Spread Spectrum Clock For Emi Solution
Manufacturer
Renesas Electronics Corporation.
Datasheet

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Part Number
Manufacturer
Quantity
Price
Part Number:
HD151TS304ARPEL
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Company:
Part Number:
HD151TS304ARPEL
Quantity:
1 491
HD151TS304ARP
Spread Spectrum Clock for EMI Solution
Description
The HD151TS304A is a high-performance Spread Spectrum Clock modulator. It is suitable for low EMI
solution.
Features
Key Specifications
Part Name
HD151TS304ARPEL
Note: Please consult the sales office for the above package availability.
Rev.4.00, May.19.2003, page 1 of 12
Supports 10 MHz to 60 MHz operation. (Designed for XIN = 24 MHz and 48 MHz)
1 copy of clock out with spread spectrum modulation @3.3 V
1 copy of reference clock @3.3 V
Programmable spread spectrum modulation ( 0.25%, 0.5%, 1.5% central spread modulation and
spread spectrum disable mode.)
SOP–8pin
Pin to pin compatible with HD151TS304RP
Supply voltages : VDD = 3.3 V±0.165 V
Ta = 0 to 70°C operating range
Clock output duty cycle = 50±5%
Cycle to cycle jitter = 250 ps typ.
Output slew rate = 0.8V/ns min.
Ordering Information
Package Type
SOP-8 pin (JEDEC)
Package Code Package
FP-8DC
Abbreviation
RP
(Previous ADE-205-691C(Z))
Taping
Abbreviation (Quantity)
EL (2,500 pcs / Reel)
REJ03D0020-0400Z
May.19.2003
Rev.4.00

Related parts for HD151TS304ARP

HD151TS304ARP Summary of contents

Page 1

... Clock output duty cycle = 50±5% Cycle to cycle jitter = 250 ps typ. Output slew rate = 0.8V/ns min. Ordering Information Part Name Package Type HD151TS304ARPEL SOP-8 pin (JEDEC) Note: Please consult the sales office for the above package availability. Rev.4.00, May.19.2003, page (Previous ADE-205-691C(Z)) Package Code Package ...

Page 2

... HD151TS304ARP Block Diagram XIN OSC 1/m R=1 M XOUT R=100 k SEL0 SEL1 R=100 k Pin Arrangement SSCCLKOUT VDD GND XIN Rev.4.00, May.19.2003, page VDD GND Synthesizer 1/n SSC Modulator Mode Control (Top view) CLKOUT SSCCLKOUT SEL1 CLKOUT SEL0 XOUT ...

Page 3

... HD151TS304ARP SSC Function Table SEL1 : Note: 1.5% SSC is selected for default by internal pull-up & down resistors. Clock Frequency Table XIN(MHz) SSCCLKOUT(MHz Notes: 1. With spread spectrum modulation. 2. Without spread spectrum modulation. Pin Descriptions Pin name No. Type GND ...

Page 4

... HD151TS304ARP Absolute Maximum Ratings Item Supply voltage Input voltage *1 Output voltage Input clamp current Output clamp current Continuous output current Maximum power dissipation 55°C (in still air) Storage temperature Notes: Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “ ...

Page 5

... HD151TS304ARP DC Electrical Characteristics 70°C, VDD = 3.3 V±5% Item Symbol Min Input low voltage V — IL Input high voltage V 2.0 IH Input current I — I — Input slew rate 1 Input capacitance C — I Operating current — DC Electrical Characteristics / Clock Output & SSC Clock Output 70°C, VDD = 3.3 V±5% ...

Page 6

... HD151TS304ARP AC Electrical Characteristics / Clock Output & SSC Clock Output Ta = 25°C, VDD = 3 Item Symbol Min *1, 2 Cycle to cycle jitter t — CCS — — — — — — *1, 2 Output frequency 23.8 47.3 23.7 47.2 23.4 46.6 23.8 47.3 *1 Slew rate t 0 Clock duty cycle 45 *1 Output impedance — ...

Page 7

... HD151TS304ARP SSCCLKOUT (or CLKOUT) Rev.4.00, May.19.2003, page tcycle n tcycle n (tcycle n) - (tcycle n+1) CCS Figure 1 Cycle to cycle jitter ...

Page 8

... HD151TS304ARP Application Information 1. Recommended Circuit Configuration The power supply circuit of the optimal performance on the application of a system should refer to Fig. 2. VDD decoupling is important to both reduce Jitter and EMI radiation. The C1 decoupling capacitor should be placed as close to the VDD pin as possible, otherwise the increased trace inductance will negate its decoupling capability ...

Page 9

... HD151TS304ARP 2. Example Board Layout Configuration G R1 SSCCLKOUT 0 Crystal connection or Reference input Figure 3 Example Board Layout Rev.4.00, May.19.2003, page VDD (+3.3 V Supply Crystal connection or Not connection Note: Via to GND plane G R1 Match value to line impedance. ...

Page 10

... HD151TS304ARP 3. Example of TS300 EMI Solution IC’s Application Spread Spectrum Spread Spectrum Modulated Clock Modulated Clock XIN XIN TS30X TS30X XOUT XOUT SSC SSC CLKOUT CLKOUT 3.3 V CMOS level ref. Clock 3.3 V CMOS level ref. Clock Spread Spectrum Spread Spectrum Modulated Clock Modulated Clock ...

Page 11

... HD151TS304ARP Package Dimensions 4.90 5.3 Max 8 1 0.75 Max 1.27 *0.42 ± 0.08 0.40 ± 0.06 *Dimension including the plating thickness Base material dimension Rev.4.00, May.19.2003, page 0.10 6.10 – 0.30 + 0.67 0.60 – 0.20 0.15 0.25 M Package Code JEDEC JEITA Mass (reference value January, 2003 Unit: mm 1.08 0 ˚ – 8 ˚ FP-8DC Conforms — ...

Page 12

... HD151TS304ARP Sales Strategic Planning Div. Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. ...

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