CRY62 TOSHIBA Semiconductor CORPORATION, CRY62 Datasheet
CRY62
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CRY62 Summary of contents
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... Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Standard Soldering Pad 1.2 1.2 2.8 CRY62~CRZ47 °C ( Symbol Rating Unit P 700 mW T −40 ~ 150 j T −40 ~ 150 stg Unit CRY62~CRZ47 °C JEDEC ― °C JEITA ― TOSHIBA 3-2A1A Weight: 0.013 g (typ.) 2006-11-09 Unit: mm ...
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... CRY62~CRZ47 Forward Reverse Voltage Current Measure -ment (V) (μA) Current I F (A) Max Max Max 3 1.0 0 1.0 0 1.0 0 1.0 0 1.0 0 1.0 ...
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... Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. of below 120° CRY62~CRZ47 -tw. RSM 2006-11-09 ...
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... Time t (s) 1000 500 300 100 0.01 0.03 0.8 1.0 (typ.) 40 CRZ30~CRZ47 (1) 10 100 4 CRY62~CRZ47 P – t RSM W P RSM t W Rectangular pulse Ta = 25°C Recommended 0.1 0 Pulse width t (ms) W α V (typ.) T – Zenner voltage V (V) Z 2006-11-09 ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 CRY62~CRZ47 20070701-EN GENERAL 2006-11-09 ...