BYD33 NXP Semiconductors, BYD33 Datasheet - Page 4

• Manufacturer Part Number: BYD33
• Description: Fast Soft-recovery Controlled Avalanche Rectifiers
• Manufacturer: NXP Semiconductors

Philips Semiconductors
THERMAL CHARACTERISTICS
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.19.
1996 Sep 18
R
R
SYMBOL
SYMBOL
dI
--------
dt
th j-tp
th j-a
Fast soft-recovery
controlled avalanche rectifiers
R
For more information please refer to the “General Part of associated Handbook” .
maximum slope of reverse recovery
current
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
BYD33D to J
BYD33K to V
PARAMETER
PARAMETER
when switched from
I
and dI
see Fig.20
F
= 1 A to V
CONDITIONS
F
4
/dt = 1 A/ s;
R
30 V
lead length = 10 mm
note 1
CONDITIONS
MIN.
TYP.
BYD33 series
Product specification
VALUE
MAX.
120
60
6
5
A/ s
A/ s
UNIT
UNIT
K/W
K/W