CRG05 TOSHIBA Semiconductor CORPORATION, CRG05 Datasheet

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CRG05

Manufacturer Part Number
CRG05
Description
Toshiba Rectifier Silicon Diffused Type
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet

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General-Purpose Rectifier Applications
Absolute Maximum Ratings
Repetitive peak reverse voltage: V
Average forward current: I
Average forward voltage: V
Suitable for high-density board assembly due to the use of a small
surface-mount package, S−FLAT
Repetitive Peak Reverse Voltage
Average Forward Current
Peak One Cycle Surge Forward
Current (Non−Repetitive)
Junction Temperature
Storage Temperature Range
Note 1: Ta=54°C
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
Device mounted on a ceramic board
board size: 50 mm × 50 mm
soldering land: 2 mm ×2 mm
board thickness: 0.64 mm
Half-sine waveform: α =180°
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Characteristics
F (AV)
FM
= 1.2V (Max.)
TOSHIBA Rectifier Silicon Diffused Type
= 1.0 A
RRM
(Ta = 25°C)
Symbol
I
V
F (AV)
I
T
FSM
RRM
T
= 800 V
stg
j
CRG05
15.0 (50Hz)
−40 to 150
−40 to 150
1.0(Note1)
Rating
800
1
Unit
°C
°C
V
A
A
Weight: 0.013 g (typ.)
JEDEC
JEITA
TOSHIBA
1.6
0.9 ± 0.1
+ 0.2
− 0.1
3-2A1A
① ANODE
② CATHODE
2008-02-01
CRG05
Unit: mm
0.16

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CRG05 Summary of contents

Page 1

... RRM = 1 1.2V (Max.) (Ta = 25°C) Symbol Rating V 800 RRM I 1.0(Note1) F (AV) I 15.0 (50Hz) FSM T −40 to 150 j T −40 to 150 stg 1 ② 0.9 ± 0.1 + 0.2 ① − 0.1 1.6 Unit V ① ANODE A ② CATHODE A °C JEDEC ― °C JEITA ― TOSHIBA 3-2A1A Weight: 0.013 g (typ.) 2008-02-01 CRG05 Unit: mm 0.16 ...

Page 2

... Soldering land × Board thickness: 0. (j-a) Device mounted on a glass-epoxy board Board size × Soldering land × Board thickness: 1 ― th (j-ℓ) Unit CRG05 Min Typ. Max ⎯ ⎯ 0.86 ⎯ ⎯ 1.0 ⎯ 1.05 1.2 ⎯ ...

Page 3

... Average forward current I 10000 (1) Device mounted on a ceramic board: Soldering land × (2) Device mounted on a glass-epoxy board: Soldering land × 1000 100 100 0.001 3 CRG05 P – (AV) F (AV) 180° 0.4 0.6 0.8 1.0 1.2 1.4 (A) F (AV) Ta max – (AV) Half-sine waveform 0° ...

Page 4

... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 4 CRG05 20070701-EN GENERAL 2008-02-01 ...

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