CMG03 TOSHIBA Semiconductor CORPORATION, CMG03 Datasheet
CMG03
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CMG03 Summary of contents
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... Symbol Rating Unit V 600 RRM I 1.0(Note1) F (AV (50 Hz) FSM −40 to 150 T j −40 to 150 T stg 1 ② ① 1.75 ± 0.1 + 0.2 − 0.1 2 °C °C JEDEC ― JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) 2008-02-01 CMG03 Unit: mm 0.16 ① ANODE ② CATHODE ...
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... R th (j-a) (soldering land × 6 mm) (board thickness: 1.6 mm) Device mounted on a glass-epoxy board (board size × 50 mm) (soldering land: 2.1 mm × 1.4 mm) (board thickness: 1.6 mm) R ― th (j-ℓ) 2 CMG03 Min Typ. Max Unit 0.88 V ― ― 0.92 1.1 V ― 10 μA ― ...
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... Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. Unit: mm 1.4 3 CMG03 for an AC circuit. RRM . Carry F(AV) 2008-02-01 ...
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... Device mounted on a glass-epoxy board: board size × Soldering land: 2.1 mm × 1.4 mm board thickness: 1.6 mm 100 10 1 Device mounted on a ceramic board: board size × Soldering land: 2.0 mm × 2.0 mm board thickness: 0.64 mm 0.1 0.001 0.01 100 4 CMG03 P – (AV) F (AV) 180° 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 (A) F (AV) Tℓ ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 CMG03 20070701-EN GENERAL 2008-02-01 ...