PBSS302NX NXP Semiconductors, PBSS302NX Datasheet - Page 11

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PBSS302NX

Manufacturer Part Number
PBSS302NX
Description
Pbss302nx 20 V, 5.3 A Npn Low Vcesat Biss Transistor
Manufacturer
NXP Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PBSS302NX
Manufacturer:
NXP
Quantity:
4 221
Part Number:
PBSS302NX
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Philips Semiconductors
11. Soldering
PBSS302NX_1
Product data sheet
Fig 16. Reflow soldering footprint SOT89 (SC-62)
Fig 17. Wave soldering footprint SOT89 (SC-62)
4.60
0.85
Dimensions in mm
Dimensions in mm
Not recommended for wave soldering
1.20
1.20
1.00
(3x)
0.20
1.50
3
0.70
5.30
2.40
6.60
Rev. 01 — 24 August 2006
3
1.20
3.70
3.95
4.75
2.25
2.00
1.90
2
1
2
0.50
20 V, 5.3 A NPN low V
1.20
3.50
3.00
1
0.60 (3x)
0.70 (3x)
7.60
0.50
1.20
1.70
transport direction during soldering
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
4.85
msa442
PBSS302NX
CEsat
solder lands
solder resist
occupied area
(BISS) transistor
solder lands
solder resist
occupied area
solder paste
MSA423
11 of 15

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