DIM200WHS17-A000 Dynex Semiconductor, DIM200WHS17-A000 Datasheet

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DIM200WHS17-A000

Manufacturer Part Number
DIM200WHS17-A000
Description
Half Bridge Igbt Module
Manufacturer
Dynex Semiconductor
Datasheet
Replaces issue December 2003, version FDS5673-2.3
FEATURES
I
I
I
APPLICATIONS
I
I
I
bridge, chopper, dual, single and bi-directional switch
configurations covering voltages from 600V to 3300V and
currents up to 3600A.
enhancement mode, insulated gate bipolar transistor (IGBT)
module. The IGBT has a wide reverse bias safe operating area
(RBSOA) plus full 10 s short circuit withstand.
and low inductance construction enabling circuit designers to
optimise circuit layouts and utilise grounded heat sinks for safety.
ORDERING INFORMATION
Order As:
DIM200WHS17-A000
Note: When ordering, please use the whole part number.
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
10 s Short Circuit Withstand
Non Punch Through Silicon
Isolated Copper Base Plate
Inverters
Motor Controllers
Induction Heating
The Powerline range of high power modules includes half
The DIM200WHS17-A000 is a half bridge 1700V, n channel
The module incorporates an electrically isolated base plate
KEY PARAMETERS
V
V
I
I
*(measured at the power busbars and not the auxiliary terminals)
C
C(PK)
CES
CE(sat)
6(G
7(E
1(E1C2)
*
2
2
)
)
(See package details for further information)
(typ)
(max)
(max)
Fig. 1 Half bridge circuit diagram
DIM200WHS17-A000
Outline type code: W
Fig. 2 Module outline
Half Bridge IGBT Module
2(E2)
1700V
2.7V
200A
400A
DIM200WHS17-A000
FDS5673-3.1 January 2004
4(G
5(E
3(C1)
1
1
)
)
1/8

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DIM200WHS17-A000 Summary of contents

Page 1

... The DIM200WHS17-A000 is a half bridge 1700V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) plus full 10 s short circuit withstand ...

Page 2

... DIM200WHS17-A000 ABSOLUTE MAXIMUM RATINGS - PER ARM Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. ...

Page 3

... GE C case 1ms 200A 200A 125˚C F case V = 25V 0V 1MHz 125˚ 1000V – L*. di/ CE(max) CES 2 IEC 60747-9 DIM200WHS17-A000 Min. Typ. Max. Units - - 4.5 5.5 V 6.5 - 2.7 3 3.4 4 200 400 A - 2.2 2.5 ...

Page 4

... DIM200WHS17-A000 ELECTRICAL CHARACTERISTICS T = 25˚C unless stated otherwise case Symbol Parameter t Turn-off delay time d(off) t Fall time f E Turn-off energy loss OFF t Turn-on delay time d(on) t Rise time r E Turn-on energy loss ON Q Gate charge g Q Diode reverse recovery charge rr I Diode reverse current ...

Page 5

... Conditions 125˚ 100A, C 120 V = 900V cc 100 off E rec (A) C Fig. 6 Typical switching energy vs gate resistance DIM200WHS17-A000 1 1.5 2 2.5 3 3.5 4 4.5 Collector-emitter voltage (V) ce Fig. 4 Typical output characteristics Gate resistance (Ohms 5 off E rec 10 5/8 ...

Page 6

... DIM200WHS17-A000 400 V is measured at power busbars F and not the auxiliary terminals 350 T 300 250 200 150 100 0.5 1.0 1.5 2.0 Foward voltage, V Fig. 7 Diode typical forward characteristics Fig. 9 Diode reverse bias safe operating area 6/8 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. ...

Page 7

... For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com 2 7 6(G ) 1(E1C2) 2(E2) Nominal weight: 420g Module outline type code: W Fig. 11 Package details DIM200WHS17-A000 3(C1 5(E ) 7/8 ...

Page 8

... HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services ...

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