DIM300WHS17-A000 Dynex Semiconductor, DIM300WHS17-A000 Datasheet

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DIM300WHS17-A000

Manufacturer Part Number
DIM300WHS17-A000
Description
Half Bridge Igbt Module
Manufacturer
Dynex Semiconductor
Datasheet
FEATURES
I
I
I
APPLICATIONS
I
I
bridge, chopper, dual, single and bi-directional switch
configurations covering voltages from 600V to 3300V and
currents up to 3600A.
channel enhancement mode, insulated gate bipolar transistor
(IGBT) module.
operating area (RBSOA) plus full 10 s short circuit withstand.
and low inductance construction enabling circuit designers to
optimise circuit layouts and utilise grounded heat sinks for safety.
ORDERING INFORMATION
Order As:
DIM300WHS17-A000
Note: When ordering, please use the whole part number.
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
10 s Short Circuit Withstand
Non Punch Through Silicon
Isolated Copper Baseplate
Inverters
Motor Controllers
The Powerline range of high power modules includes half
The DIM300WHS17-A000 is a half bridge switch 1700V, n
The module incorporates an electrically isolated base plate
The IGBT has a wide reverse bias safe
KEY PARAMETERS
V
V
I
I
*(measured at the power busbars and not the auxiliary terminals)
C
C(PK)
CES
CE(sat)
*
6(G
7(E
1(E1C2)
Fig. 2 Electrical connections - (not to scale)
(See package details for further information)
2
2
)
)
(typ)
(max)
(max)
Fig. 1 Half bridge circuit diagram
DIM300WHS17-A000
Outline type code: W
Half Bridge IGBT Module
1700V
2.7V
300A
600A
2(E2)
DIM300WHS17-A000
FDS5694-1.2 December 2003
4(G
5(E
3(C1)
1
1
)
)
1/8

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DIM300WHS17-A000 Summary of contents

Page 1

... The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 600V to 3300V and currents up to 3600A. The DIM300WHS17-A000 is a half bridge switch 1700V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) plus full 10 s short circuit withstand ...

Page 2

... DIM300WHS17-A000 ABSOLUTE MAXIMUM RATINGS - PER ARM Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. ...

Page 3

... GE C case 1ms 300A 300A 125˚C F case V = 25V 0V 1MHz 125˚ 1000V – L*. di/ CE(max) CES 2 IEC 60747-9 DIM300WHS17-A000 Min. Typ. Max. Units - - 4.5 5.5 V 6.5 - 2.7 3 3.4 4 300 600 A - 2.2 2.3 ...

Page 4

... DIM300WHS17-A000 ELECTRICAL CHARACTERISTICS T = 25˚C unless stated otherwise case Symbol Parameter t Turn-off delay time d(off) t Fall time f E Turn-off energy loss OFF t Turn-on delay time d(on) t Rise time r E Turn-on energy loss ON Q Gate charge g Q Diode reverse recovery charge rr I Diode reverse current ...

Page 5

... 125°C 250 c 200 150 100 50 E off rec 0 300 400 0 - (A) C Fig. 6 Typical switching energy vs gate resistance DIM300WHS17-A000 = 125˚ 20V GE 15V 12V 10V 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 Collector-emitter voltage (V) ce Fig. 4 Typical output characteristics Gate Resistance (Ohms) ...

Page 6

... DIM300WHS17-A000 600 V is measured at power busbars F and not the auxiliary terminals 500 T j 400 300 200 100 0 0 0.5 1.0 1.5 2.0 Foward voltage, V Fig. 7 Diode typical forward characteristics Fig. 9 Diode reverse bias safe operating area 6/8 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. ...

Page 7

... For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com 2 7 6(G ) 1(E1C2) 2(E2) Nominal weight: 420g Module outline type code: W Fig. 11 Package details DIM300WHS17-A000 3(C1 5(E ) 7/8 ...

Page 8

... HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services ...

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