MC14503BDG ON Semiconductor, MC14503BDG Datasheet - Page 7

• Manufacturer Part Number: MC14503BDG
• Description: IC BUFF TRI-ST HEX N-INV 16SOIC
• Manufacturer: ON Semiconductor
• Series: 4000Br

Specifications of MC14503BDG

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 2
• Number Of Bits Per Element: 2, 4 (Hex)
• Current - Output High, Low: 14.1mA, 25mA
• Voltage - Supply: 3 V ~ 18 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (3.9mm Width)
• Logic Family: MC14
• Number Of Channels Per Chip: Hex
• Polarity: Non-Inverting
• Supply Voltage (max): 18 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: 125 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 8.2 mA (Min)
• Input Bias Current (max): 4 uA
• Low Level Output Current: 19.2 mA (Min)
• Maximum Power Dissipation: 500 mW
• Minimum Operating Temperature: - 55 C
• Number Of Lines (input / Output): 3
• Output Type: 3-State
• Propagation Delay Time: 150 ns @ 5 V or 70 ns @ 10 V or 50 ns @ 15 V
• Logic Device Type: Buffer, Non Inverting
• Supply Voltage Range: 3V To 18V
• Logic Case Style: SOIC
• No. Of Pins: 16
• Operating Temperature Range: -55°C To +125°C
• Termination Type: SMD
• Rohs Compliant: Yes
• Filter Terminals: SMD
• Family Type: 4000 CMOS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC14503BDG; MC14503BDGOS

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e
16
1
0.13 (0.005)
Z
b
D
M
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
9
8
A
E
0.10 (0.004)
A
H
1
E
VIEW P
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
M
_
L
http://onsemi.com
E
CASE 966−01
MC14503B
SOEIAJ−16
ISSUE A
L
DETAIL P
7
Q
1
c
NOTES:
1.
2.
3.
4.
5.
Y14.5M, 1982.
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
M
A
b
c
D
E
e
L
L
Q
Z
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
E
1
E
DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE
TERMINAL NUMBERS ARE SHOWN FOR
THE LEAD WIDTH DIMENSION (b) DOES NOT
1
MILLIMETERS
MIN
0.05
0.35
0.10
9.90
5.10
7.40
0.50
0.70
1.10
−−−
−−−
0
1.27 BSC
_
10.50
MAX
10
2.05
0.20
0.50
0.20
5.45
8.20
0.85
1.50
0.90
0.78
_
0.002
0.014
0.007
0.390
0.201
0.291
0.020
0.043
0.028
MIN
−−−
−−−
0
0.050 BSC
INCHES
_
MC14503B/D
0.081
0.008
0.020
0.413
0.215
0.323
0.033
0.059
0.035
0.031
MAX
0.011
10
_