MD18R3268AG0 Samsung Semiconductor, Inc., MD18R3268AG0 Datasheet - Page 13

• Manufacturer Part Number: MD18R3268AG0
• Description: Description = MD18R3268AG0 (32Mx18)x8(16)pcs RIMM(TM) Module Based on 576Mb A-die, 32s Banks,32K/32ms Ref, 2.5V ;; Density(MB) = 512 ;; Organization = 128Mx36 ;; Component Composition = 576M(2th)x8 ;; Voltage(V) = 2.5 ;; Refresh = 32K/32ms ;; Speed(M
• Manufacturer: Samsung Semiconductor, Inc.

MD18R3268(G)AG0
Physical Dimensions -1 ( For PCB )
The following defines the 2 channel RDRAM module dimensions. All units are in millimeters with inches in brackets[ ], where appropriate.
The dimensions without tolerance specification use the default tolerance of ±0.127[±0.005].
5.68[0.2236]
A-1
B-1
[0.006
0.15
[0.031
2.85[0.112]
±
±
0.80
0.10
0.004]
Note : The gray area above represents the contact surface of the heat spreader.
DIA 2.44
±
±
R 2.00
R 2.00
0.10
0.004]
Heat spreader
DIA 2.44
DETAIL A
Figure 3 : 32 bit RIMM Module PCB Physical Dimensions
1.00[0.039]
COMPONENT AREA
COMPONENT AREA
[0.12
1.00[0.039]
2.99
±
±
0.002]
0.05
133.35
(B SIDE)
(A SIDE)
Min.4.88
[0.192]
±
127.65[5.026]
Page 12
0.127[5.250
±
0.005]
[0.118
3.00
±
±
0.10
0.004]
DETAIL B
32 Bit RIMM
Version 0.1 Sept. 2003
A-116
2.85[0.112]
B-116
[0.118
3.00
±
±
0.004]
0.10
Preliminary
®
8.60[0.339]
[0.157
7.468[0.294]
4.00
Module
±
±
0.15
0.006]