74ALVCH16825DLG4

Manufacturer Part Number74ALVCH16825DLG4
DescriptionIC BUFF/DVR TRI-ST 18BIT 56SSOP
ManufacturerTexas Instruments
Series74ALVCH
74ALVCH16825DLG4 datasheets

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Specifications of 74ALVCH16825DLG4

Logic TypeBuffer/Line Driver, Non-InvertingNumber Of Elements2
Number Of Bits Per Element9Current - Output High, Low24mA, 24mA
Voltage - Supply1.65 V ~ 3.6 VOperating Temperature-40°C ~ 85°C
Mounting TypeSurface MountPackage / Case56-SSOP
Logic FamilyALVCNumber Of Channels Per Chip18
PolarityNon-InvertingSupply Voltage (max)3.6 V
Supply Voltage (min)1.65 VMaximum Operating Temperature+ 85 C
Mounting StyleSMD/SMTHigh Level Output Current- 24 mA
Low Level Output Current24 mAMinimum Operating Temperature- 40 C
Number Of Lines (input / Output)18 / 18Output Type3-State
Propagation Delay Time3.9 ns at 2.7 VLead Free Status / RoHS StatusLead free / RoHS Compliant
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PACKAGING INFORMATION
(1)
Orderable Device
Status
74ALVCH16825DGGRE4
ACTIVE
74ALVCH16825DGGRG4
ACTIVE
74ALVCH16825DLG4
ACTIVE
74ALVCH16825DLRG4
ACTIVE
SN74ALVCH16825DGGR
ACTIVE
SN74ALVCH16825DL
ACTIVE
SN74ALVCH16825DLR
ACTIVE
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
Package
Package
Pins Package
Type
Drawing
Qty
TSSOP
DGG
56
2000 Green (RoHS &
TSSOP
DGG
56
2000 Green (RoHS &
SSOP
DL
56
20
Green (RoHS &
SSOP
DL
56
1000 Green (RoHS &
TSSOP
DGG
56
2000 Green (RoHS &
SSOP
DL
56
20
Green (RoHS &
SSOP
DL
56
1000 Green (RoHS &
Addendum-Page 1
(2)
Eco Plan
Lead/Ball Finish
MSL Peak Temp
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
27-Sep-2007
(3)

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