BU508DX Philips Semiconductors (Acquired by NXP), BU508DX Datasheet
BU508DX
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BU508DX Summary of contents
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... 16kHz 16kHz Csat PIN CONFIGURATION case CONDITIONS ˚C hs CONDITIONS without heatsink compound with heatsink compound in free air 1 Product specification BU508DX TYP. MAX. UNIT - 1500 V - 700 1 1.6 2.0 V 0.7 - ...
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... 100 mA 4 CONDITIONS I = 0.1 A 4.5 A;L 1 mH;C Csat 1 B(end 2. Product specification BU508DX MIN. TYP. MAX. - 2500 - 22 - MIN. TYP. MAX 1 2 700 - - - - 1 1 1.6 2.0 TYP. MAX 125 - ...
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... July 1998 ICsat t IBend t IBend -VBB t Fig.3. Switching times test circuit ICsat 100 0.1 - IBM Fig.4. Typical DC current gain Product specification BU508DX + 150 v nominal adjust for ICsat 1mH D.U.T. LB 12nF BU508AD parameter V CE Rev 1.200 ...
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... BU508AD PD% 120 110 100 Fig.8. Normalised power dissipation Product specification BU508DX BU508AD 4. IB/A V sat = parameter Normalised Power Derating with heatsink compound 100 120 140 Ths / C PD% = 100 P ...
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... Fig.11. Forward bias safe operating area NB: Mounted without heatsink compound and 100 1000 VCE / V = 25˚ Product specification BU508DX 0.01 ICM max IC max II Ptot max 100 VCE / V Region of permissible DC operation. Extension for repetitive pulse operation. ...
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... Net Mass: 5.88 g 4.5 27 max 22.5 max 18.1 min Fig.12. SOT399; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". July 1998 16.0 max 0.7 10.0 25.1 25.7 5.1 2.2 max 4.5 1.1 0.4 M 5.45 5.45 6 Product specification BU508DX 5.8 max 3.0 3 0.95 max 3.3 Rev 1.200 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1998 7 Product specification BU508DX Rev 1.200 ...