CM6136 ON Semiconductor, CM6136 Datasheet

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CM6136

Manufacturer Part Number
CM6136
Description
Cm6136 Single-channel Transient Voltage Suppressor
Manufacturer
ON Semiconductor
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CM6136
Manufacturer:
ON/安森美
Quantity:
20 000
CM6136
Single-Channel Transient
Voltage Suppressor
Product Description
Passivet (ASIPt) component in a 2 x 2, 4−bump, 0.4 mm pitch, CSP
form factor. This device is designed for:
Features
© Semiconductor Components Industries, LLC, 2011
April, 2011 − Rev. 1
Orientation
Table 1. PIN DESCRIPTIONS
ON Semiconductor’s CM6136 is an Application Specific Integrated
Fuse
Transient Voltage Suppression (TVS)
Electrostatic Discharge Protection
Electrical Overstress Protection
4−Bump, 0.8 mm X 0.8 mm Footprint Chip Scale Package (CSP)
These Devices are Pb−Free and are RoHS Compliant
B1 & B2
Marking
Pin
A1
A2
A
B
(Bumps Down View)
Fuse Terminal 1
TVS Channel / Fuse Terminal 2
Device Ground
+
PACKAGE / PINOUT DIAGRAMS
1
Top View
FX
4−Bump CSP Package
4−bump CSP Package
2
X = Single Digit Date Code
Description
A
B
(Bumps Up View)
Bottom View
A2
B2
2
A1
B1
1
A1
Orientation
Marking
1
CM6136
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Device
F
X
A1
ORDERING INFORMATION
ELECTRICAL SCHEMATIC
MARKING DIAGRAM
= CM6136
= Single Digit Date Code
http://onsemi.com
Fuse
(Pb−Free)
Package
WLCSP4
CASE 567CA
CP SUFFIX
WLCSP4
FX
B1 & B2
Publication Order Number:
GND
10,000/Tape & Reel
TVS
Shipping
A2
CM6136/D

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CM6136 Summary of contents

Page 1

... CM6136 Single-Channel Transient Voltage Suppressor Product Description ON Semiconductor’s CM6136 is an Application Specific Integrated Passivet (ASIPt) component 4−bump, 0.4 mm pitch, CSP form factor. This device is designed for: • Fuse • Transient Voltage Suppression (TVS) • Electrostatic Discharge Protection • ...

Page 2

... See Notes 1 and The device must not burn to open−circuit, when the value is below maximum I 2. This parameter is characterized at 25°C using an ON Semiconductor−specific test board. Table 3. PARAMETERS AND OPERATING CONDITIONS Parameter Storage Temperature Range Operating Temperature Range Table 4 ...

Page 3

T = 255C Environment − −20 dB − −40 dB − CHARACTERISTICS 100 FR EQUEN CY (MH z) Figure 1. Insertion Loss (0 V and ...

Page 4

... COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. MILLIMETERS DIM MIN MAX A 0.47 0.53 A1 0.17 0.24 A2 0.30 REF b 0.24 0.29 D 0.80 BSC E 0.80 BSC e 0.40 BSC RECOMMENDED SOLDERING FOOTPRINT* A1 PACKAGE OUTLINE 4X 0.25 0.40 PITCH DIMENSIONS: MILLIMETERS ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CM6136/D ...

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