MT9M114 Aptina Imaging Corporation, MT9M114 Datasheet - Page 10

no-image

MT9M114

Manufacturer Part Number
MT9M114
Description
1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Image Sensor Die
Manufacturer
Aptina Imaging Corporation
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT9M114EBLSTC
Manufacturer:
MICRON
Quantity:
1 000
Part Number:
MT9M114EBLSTCZ
Manufacturer:
ATI
Quantity:
60 000
Company:
Part Number:
MT9M114EBLSTCZ
Quantity:
50
Company:
Part Number:
MT9M114EBLSTCZ
Quantity:
50
Company:
Part Number:
MT9M114EBLSTCZ
Quantity:
698
Part Number:
MT9M114EBLSTCZ-CR
Manufacturer:
SEMIKRON
Quantity:
120
Company:
Part Number:
MT9M114EBLSTCZ-CR
Quantity:
5 000
Physical Specifications
Table 3:
Figure 3:
PDF: 0834020843/Source:7792798679
MT9M114 DDS - Rev. A 9/09 EN
276mm
Die Dimensions
Die Orientation in Reconstructed Wafer
Features
Die thickness
Singulated die size
Width:
Length:
Bond pad size (MIN)
Passivation openings (MIN)
Minimum bond pad pitch
Optical array
Optical center from die center:
First active pixel (col. 8, row 2)
From die center:
Last active pixel (col. 11303, row 977)
From die center:
MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital
276mm
Aptina Confidential and Proprietary
10
Dimensions
200μm ±12μm
3858 μm ±25 μm
4658 μm ±25 μm
85 μm x 100 μm
(3.35 mil x 3.94 mil)
75 μm x 90 μm
(2.95 mil x 3.54 mil)
110.4 μm (4.34203 mil)
X = –0.1 μm, Y = –87.195 μm
X = –1231.30μm, Y = –1014.395μm
X =1231.10 μm, Y = 840.005 μm
Singulated die size:
Width: 3858 μm ±25 μm
Length: 4658 μm ±25 μm
Reconstructed wafer
street width: 762 μm
Number of rows: 35
Number of columns: 41
Dicing tape: Adwill D-175
Film frame: Disco
Maximum total die count: 1170
Aptina eserves the right to change products or specifications without notice.
762μm
©2009 Aptina Imaging Corporation All rights reserved.
Image Sensor Die
www.DataSheet4U.com
Bond pad 1
orientation
Advance
762μm

Related parts for MT9M114