MT9M114 Aptina Imaging Corporation, MT9M114 Datasheet - Page 3

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MT9M114

Manufacturer Part Number
MT9M114
Description
1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Image Sensor Die
Manufacturer
Aptina Imaging Corporation
Datasheet

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Bonding Instructions
Storage Requirements
Figure 1:
PDF: 0834020843/Source:7792798679
MT9M114 DDS - Rev. A 9/09 EN
Typical Configuration (Connection)
Notes:
The MT9M114 Imager die has 55 bond pads. Refer to Table 1 on page 5 and Table 2 on
page 7 for a complete list of bond pads and coordinates.
The MT9M114 Imager die does not require the user to determine bond option features.
The MT9M114 Imager die also has several pads defined as “do not use.” These pads are
reserved for engineering purposes and should not be used. Bonding these pads could
result in a nonfunctional die.
Figure 1 on page 3 shows the MT9M114 typical die connections. For low-noise opera-
tion, the MT9M114 die requires separate supplies for analog and digital power.
Aptina die products are packaged for shipping in a cleanroom environment. Upon
receipt, the customer should transfer the die to a similar environment for storage. Aptina
recommends the die be maintained in a filtered nitrogen atmosphere until removed for
assembly. The moisture content of the storage facility should be maintained at 30
percent relative humidity ±10 percent. ESD damage precautions are necessary during
handling. The die must be in an ESD-protected environment at all times for inspection
and assembly.
1. This typical configuration shows only one scenario out of multiple possible variations for this sensor.
2. If a MIPI Interface is not required, the following signals must be left floating: DATA_P, DATA_N, CLK_P,
3. Only one of the output modes (serial or parallel) can be used at any time.
serial interface
Active LOW reset
External clock in
and CLK_N. The VDD_PHY power signal must always be connected to the 1.8V supply.
Two-wire
(6–54 MHz)
MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital
R
PULL-UP
V
DD
5
_IO
5, 7
Aptina Confidential and Proprietary
V
DD
OE_BAR
TRST_BAR
S
S
SCLK
RESET_BAR
EXTCLK
D
power
V
_PHY
ADDR
DATA
I/O
GND
DD
_IO
5
2, 7
8
6
V
power
PHY
DD
V
_PHY
DD
3
2
_PLL
7
V
power
DD
PLL
GND_PLL
_PLL
Digital
V
power
DD 7
core
V
DD
A
GND
Analog
power
V
FRAME_VALID
AA
LINE_VALID
D
DATA_N
OUT
DATA_P
PIXCLK
CLK_N
CLK_P
[7:0]
Aptina reserves the right to change products or specifications without notice.
Parallel
Port
MIPI
Serial
Port
©2009 Aptina Imaging Corporation. All rights reserved.
OR
4
Image Sensor Die
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