MT9M114 Aptina Imaging Corporation, MT9M114 Datasheet - Page 8

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MT9M114

Manufacturer Part Number
MT9M114
Description
1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Image Sensor Die
Manufacturer
Aptina Imaging Corporation
Datasheet

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Table 2:
PDF: 0834020843/Source:7792798679
MT9M114 DDS - Rev. A 9/09 EN
Pad Number
45
46
47
48
49
50
51
52
53
54
55
Bond Pad Location and Identification
Notes:
DOUT_LSB0
D
V
Pad Name
V
DATA_N
OUT
DATA_P
DD
DD
CLK_N
GND3
GND4
CLK_P
V
_PHY0
DD
_PLL0
_LSB1
1
1. Reference to center of each bond pad from center of die (0, 0).
2. DNU = do not use.” See “Bonding Instructions” on page 3.
MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital
–2248.49
–2248.49
–2248.49
–2248.49
–2248.49
–2248.49
–2248.49
–2248.49
–2248.49
–2248.49
–2248.49
Microns
Aptina Confidential and Proprietary
"X"
1
From Center of Die (0,0)
8
–517.15
–359.95
–202.75
1057.89
1277.89
1459.25
Microns
–45.55
111.65
268.85
450.21
670.21
"Y"
1
(continued)
–0.088523228
–0.088523228
–0.088523228
–0.088523228
–0.088523228
–0.088523228
–0.088523228
–0.088523228
–0.088523228
–0.088523228
–0.088523228
Aptina reserves the right to change products or specifications without notice.
Inches
"X"
1
©2009 Aptina Imaging Corporation. All rights reserved.
Image Sensor Die
–0.020360236
–0.007982283
–0.001793307
www.DataSheet4U.com
–0.01417126
0.004395669
0.010584646
0.017724803
0.041649213
0.057450787
0.02638622
0.05031063
Inches
"Y"
1
Advance

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