M1MA174 ON Semiconductor, M1MA174 Datasheet
M1MA174
Related parts for M1MA174
M1MA174 Summary of contents
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... SC–70/SOT–323 CASE 419 STYLE 2 MARKING DIAGRAM Device Code M = Date Code ORDERING INFORMATION Device Package Shipping M1MA174T1 SC–70 3000/Tape & Reel Preferred devices are recommended choices for future use and best overall value. Publication Order Number: M1MA174T1/D ...
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... M1MA174T1 Notes 2.0 k variable resistor adjusted for a Forward Current ( mA. Notes: 2. Input pulse is adjusted so I R(peak) is equal to 10 mA. Notes » Figure 1. Recovery Time Equivalent Test Circuit Figure 2. Forward Voltage Figure 4. Capacitance http://onsemi.com Figure 3. Leakage Current 2 ...
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... When using infrared heating with the reflow soldering method, the difference should be a maximum M1MA174T1 interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. ...
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... This profile shows temperature versus time. M1MA174T1 SOLDER STENCIL GUIDELINES The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i ...
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... M1MA174T1 PACKAGE DIMENSIONS SC–70 (SOT–323) CASE 419–04 ISSUE http://onsemi.com ...
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... Notes M1MA174T1 http://onsemi.com 6 ...
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... Notes M1MA174T1 http://onsemi.com 7 ...
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... N. American Technical Support: 800–282–9855 Toll Free USA/Canada M1MA174T1 JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. http://onsemi.com 8 M1MA174T1/D ...