ISL653031EVAL1 Intersil Corporation, ISL653031EVAL1 Datasheet - Page 5

• Manufacturer Part Number: ISL653031EVAL1
• Description: Dual 5V Synchronous Buck Pulse-Width Modulator (PWM) Controller for DDRAM Memory VDDQ and VTT Termination
• Manufacturer: Intersil Corporation

Absolute Maximum Ratings
Supply Voltage, V
Boot Voltage, V
Input, Output or I/O Voltage . . . . . . . . . . . . GND -0.3V to V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 2
Operating Conditions
Supply Voltage, V
Ambient Temperature Range. . . . . . . . . . . . . . . . . . . . . 0
Junction Temperature Range . . . . . . . . . . . . . . . . . . . 0
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Electrical Specifications
VCC SUPPLY CURRENT
Nominal Supply
Shutdown Supply
POWER-ON RESET
Rising V
Falling V
OSCILLATOR
Free Running Frequency
REFERENCES
Reference Voltage
(V2 Error Amp Reference)
V1 Error Amp Reference Voltage
Tolerance
V1 Error Amp Reference
ERROR AMPLIFIERS
DC Gain
Gain-Bandwidth Product
Slew Rate
WINDOW REGULATOR
Load Current
Output Voltage Error
GATE DRIVERS
Upper Gate Source (UGATE1 and 2)
Upper Gate Sink (UGATE1 and 2)
Lower Gate Source (LGATE1 and 2)
Lower Gate Sink (LGATE1 and 2)
PROTECTION
OCSET/SD Current Source
OCSET/SD Disable Voltage
1. θ
2. θ
“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
JA
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. θ
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
CC
CC
Threshold
Threshold
PARAMETER
BOOTn
CC
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V ±10%
- V
PHASEn
5
. . . . . . . . . . . . . . . . . . . . . . +7.0V
Recommended Operating Conditions with Vcc = 5V, Unless Otherwise Noted
SYMBOL
V
I
I
I
I
I
V
UGATE
UGATE
OCSET
LGATE
LGATE
V
GBW
RESET
VREF
I
SR
REF
CC
o
OCSET/SD = V
UGATE1, UGATE2, LGATE1, and LGATE2
Open
OCSET/SD = 0V
V
V
V
SENSE1 = 2.5V
V
COMP = 10pF
V2_SD = VCC; ±10mA load on V2
V
V
V
V
V
C to 125
o
OCSET/SD
OCSET/SD
CC
CC
CC
UGATE-PHASE
CC
LGATE
OCSET
C to 70
CC
= 5
= 5
= 5V, V
= 5V, V
+0.3V
= 2.5V
o
o
= 4.5VDC
C
C
ISL6530
TEST CONDITIONS
= 4.5V
= 4.5V
UGATE
LGATE
CC
= 2.5V
;
= 2.5V
= 2.5V
Thermal Information
Thermal Resistance
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150
Maximum Storage Temperature Range . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
For Recommended soldering conditions see Tech Brief TB389.
SOIC Package (Note 1) . . . . . . . . . . . .
QFN Package (Note 2). . . . . . . . . . . . .
(SOIC - Lead tips only)
4.25
3.75
49.5
MIN
275
34
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP
300
±10
0.8
0.8
50
82
15
±7
40
-1
-1
3
6
5
1
2
-
-
-
θ
JA
(
65
33
MAX
o
50.5
325
4.5
4.0
C/W) θ
46
2
-
-
-
-
-
-
-
-
-
-
-
-
o
C to 150
%SENSE1
JC
UNITS
MHz
V/µs
kHz
N/A
mA
mA
mA
dB
µA
(
JC,
%
%
V
V
V
A
A
A
A
V
o
4
C/W)
the
o
o
o
C
C
C