MMDF2C02E Motorola, MMDF2C02E Datasheet

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MMDF2C02E

Manufacturer Part Number
MMDF2C02E
Description
COMPLEMENTARY DUAL TMOS POWER FET 2.5 AMPERES 25 VOLTS
Manufacturer
Motorola
Datasheet

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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Designer's
Medium Power Surface Mount Products
Complementary TMOS
Field Effect Transistors
which utilize Motorola’s TMOS process. These miniature surface
mount MOSFETs feature ultra low R DS(on) and true logic level
performance. They are capable of withstanding high energy in the
avalanche and commutation modes and the drain–to–source diode
has a low reverse recovery time. MiniMOS devices are designed
for use in low voltage, high speed switching applications where
power efficiency is important. Typical applications are dc–dc
converters, and power management in portable and battery
powered products such as computers, printers, cellular and
cordless phones. They can also be used for low voltage motor
controls in mass storage products such as disk drives and tape
drives. The avalanche energy is specified to eliminate the
guesswork in designs where inductive loads are switched and offer
additional safety margin against unexpected voltage transients.
(1) Negative signs for P–Channel device omitted for clarity.
(2) Mounted on 2” square FR4 board (1” sq. 2 oz. Cu 0.06” thick single sided) with one die operating, 10 sec. max.
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
Designer’s and MiniMOS are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
REV 5
MAXIMUM RATINGS
DEVICE MARKING
Motorola TMOS Power MOSFET Transistor Device Data
Drain–to–Source Voltage
Gate–to–Source Voltage
Drain Current — Continuous
Operating and Storage Temperature Range
Total Power Dissipation @ T A = 25 C (2)
Single Pulse Drain–to–Source Avalanche Energy — Starting T J = 25 C
Thermal Resistance — Junction to Ambient (2)
Maximum Lead Temperature for Soldering, 0.0625 from case. Time in Solder Bath is 10 seconds.
F2C02
MMDF2C02ER2
MiniMOS
Motorola, Inc. 1996
Ultra Low R DS(on) Provides Higher Efficiency and Extends
Battery Life
Logic Level Gate Drive — Can Be Driven by Logic ICs
Miniature SO–8 Surface Mount Package — Saves Board Space
Diode Is Characterized for Use In Bridge Circuits
Diode Exhibits High Speed, with Soft Recovery
Avalanche Energy Specified
Mounting Information for SO–8 Package Provided
(V DD = 20 V, V GS = 10 V, Peak I L = 9.0 A, L = 6.0 mH, R G = 25 )
(V DD = 20 V, V GS = 10 V, Peak I L = 7.0 A, L = 10 mH, R G = 25 )
Device
devices are an advanced series of power MOSFETs
— Pulsed
(T J = 25 C unless otherwise noted) (1)
Reel Size
ORDERING INFORMATION
Data Sheet
13
N–Channel
P–Channel
N–Channel
P–Channel
12 mm embossed tape
Rating
Tape Width
2500 units
Quantity
N–Channel
P–Channel
P–Channel
N–Channel
G
G
D
D
S
S
T J and T stg
Symbol
V DSS
R JA
V GS
E AS
I DM
N–Source
P D
P–Source
MMDF2C02E
T L
I D
DUAL TMOS POWER FET
N–Gate
P–Gate
R DS(on) = 0.100 OHM
R DS(on) = 0.25 OHM
CASE 751–05, Style 14
COMPLEMENTARY
(N–CHANNEL)
(P–CHANNEL)
2.5 AMPERES
25 VOLTS
– 55 to 150
Order this document
Top View
SO–8
Value
1
2
3
4
62.5
by MMDF2C02E/D
245
245
260
3.6
2.5
2.0
25
18
13
20
8
7
6
5
Watts
N–Drain
N–Drain
P–Drain
P–Drain
Unit
Vdc
Vdc
Adc
C/W
mJ
C
C
1

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MMDF2C02E Summary of contents

Page 1

... Motorola TMOS Power MOSFET Transistor Device Data Motorola, Inc. 1996 D N–Channel G D P–Channel G Rating N–Channel P–Channel Tape Width Quantity 2500 units Order this document by MMDF2C02E/D MMDF2C02E COMPLEMENTARY DUAL TMOS POWER FET 2.5 AMPERES 25 VOLTS R DS(on) = 0.100 OHM (N–CHANNEL) R DS(on) = 0.25 OHM (P–CHANNEL) CASE 751–05, Style 14 SO– N– ...

Page 2

... MMDF2C02E ( unless otherwise noted) (1) ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain–Source Breakdown Voltage ( Vdc 250 Adc) Zero Gate Voltage Drain Current ( Vdc Vdc) Gate–Body Leakage Current ( Vdc CHARACTERISTICS (2) Gate Threshold Voltage ( 250 Adc) Drain– ...

Page 3

... 0.4 1.5 1. DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 1. On–Region Characteristics 3 GATE–TO–SOURCE VOLTAGE (VOLTS) Figure 2. Transfer Characteristics MMDF2C02E Min Typ Max Unit — 1.0 1.4 Vdc — 1.5 2.0 — — — 17 — ...

Page 4

... MMDF2C02E TYPICAL ELECTRICAL CHARACTERISTICS N–Channel 0.6 0.5 0.4 0.3 0.2 0 GATE–TO–SOURCE VOLTAGE (VOLTS) Figure 3. On–Resistance versus Gate–to–Source Voltage 0. 4 DRAIN CURRENT (AMPS) Figure 4. On–Resistance versus Drain Current and Gate Voltage 2 ...

Page 5

... The MOSFET output capacitance also complicates the mathematics. And finally, MOSFETs have finite internal gate resistance which effectively adds to the resistance of the driving source, but the internal resistance is difficult to mea- sure and, consequently, is not specified. MMDF2C02E P–Channel 125 C 100 ...

Page 6

... MMDF2C02E DRAIN–TO–SOURCE DIODE CHARACTERISTICS The switching characteristics of a MOSFET body diode are very important in systems using freewheeling or commutating diode. Of particular interest are the reverse re- covery characteristics which play a major role in determining switching losses, radiated noise, EMI and RFI. ...

Page 7

... STARTING JUNCTION TEMPERATURE ( C) Figure 9. Maximum Avalanche Energy versus MMDF2C02E P–Channel Mounted on 2” sq. FR4 board (1” sq. 2 oz. Cu 0.06” thick single sided) with one die operating, 10s max 100 DS(on) LIMIT THERMAL LIMIT ...

Page 8

... MMDF2C02E 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 SINGLE PULSE 0.001 1.0E–05 1.0E–04 1.0E–03 Figure 11. Diode Reverse Recovery Waveform 8 Chip 0.0175 0.0710 0.0154 F 0.0854 F 1.0E–02 1.0E–01 1.0E+00 t, TIME (s) Figure 10. Thermal Response di/ 0. Motorola TMOS Power MOSFET Transistor Device Data Normalized 10s. ...

Page 9

... Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. MMDF2C02E 150 C – 2.0 Watts 62.5 C/W 9 ...

Page 10

... MMDF2C02E For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next ...

Page 11

... PACKAGE DIMENSIONS CASE 751–05 SO–8 ISSUE P MMDF2C02E NOTES: 1. DIMENSIONS A AND B ARE DATUMS AND DATUM SURFACE. 2. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 3. DIMENSIONS ARE IN MILLIMETER. 4. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. ...

Page 12

... JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 *MMDF2C02E/D* Motorola TMOS Power MOSFET Transistor Device Data MMDF2C02E/D ...

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