CMA3000 VTI Hamlin, CMA3000 Datasheet
CMA3000
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CMA3000 Summary of contents
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... CMA3000 Assembly Instructions CMA3000 Series 3-axis accelerometer ...
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... TABLE OF CONTENTS 1 Objective ............................................................................................................................... 3 2 VTI's 3D Stacked Wafer Level Chip-on-MEMS Package (CoM) ........................................ 3 3 CMA3000 CoM Package Outline and Dimensions ............................................................. 4 4 Packing ................................................................................................................................. 6 4.1 Tape and Reel Specifications .................................................................................................. 6 4.2 Reel packing and outer box ..................................................................................................... 8 5 Printed Wiring Board (PWB) Level Guidelines .................................................................. 9 5.1 PWB layout ................................................................................................................................ 9 5.2 Solder Paste ............................................................................................................................ 10 5 ...
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... Objective This document describes guidelines for Printed Wiring Board (PWB) design and assembly of the CMA3000 3-axis Accelerometer. It also aims to help customers achieve the optimum soldering process. 2 VTI's 3D Stacked Wafer Level Chip-on-MEMS Package (CoM) CMA3000 features a novel packaging concept, which is called Chip-on-MEMS (CoM). Its approach has been to maintain the benefits of manufacturing the MEMS devices and ASICs on separate wafers ...
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... Solder sphere surfaces may contain marks originated form the calibration process. However, these are not considered damage and they do not have an effect on solderability. Figure 2. Outline and dimensions for the CMA3000 component mm with ±50 µm tolerance for reference only. Please check the corresponding data sheet for details. ...
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... Pin 1 index mark can be seen in Figure 3. Please note that due to small size, index mark can’t be seen without magnification. The use of microscope or equivalent piece of equipment is recommended. Figure 3. Pin 1 index mark on top of CMA3000. VTI Technologies Oy www.vti.fi PRELIMINARY Subject to changes TN68 CMA3000 Assembly Instructions 5/18 Rev ...
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... Tape and Reel Specifications − Carrier Tape TW014401 width 8.00 +0. -0.10 mm − Cover Tape 3M 2678, width 5.4 mm − Polystyrene Reel, 180 mm diameter A TAPE WIDTH 8 180 -2 Figure 4. Reel dimensions [mm]. VTI Technologies Oy www.vti. (max) 60 8.4 14.4 8.4 ±2 +1.5 +2.5 -0.0 -0.5 PRELIMINARY Subject to changes TN68 CMA3000 Assembly Instructions E 4 ±0.1 6/18 Rev.09 ...
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... Figure 5. Tape dimensions [mm]. The polarity of the part on tape looks as follows: Direction of unreeling Figure 6 CMA3000's orientation on a tape. VTI Technologies Oy www.vti.fi Pin #1 of CMA3000 component (top view, not in scale) PRELIMINARY Subject to changes TN68 CMA3000 Assembly Instructions 7/18 Rev.09 ...
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... Reel packing and outer box Figure 7 Reel packing and outer box VTI Technologies Oy www.vti.fi PRELIMINARY Subject to changes TN68 CMA3000 Assembly Instructions 8/18 Rev.09 ...
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... Symmetrical pad and trace designs on the CMA3000 component PWB area are highly recommended as those would guarantee an optimal component performance. Moreover, traces should not be routed beneath the CMA3000 component, but to use ground plane instead in order to optimize immunity to noise coupled from signal lines. Recommended PWB land pattern and dimensions for the CMA3000 component are presented in Figure 8 ...
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... SAC solder can vary between 217–221°C, depending on the composition of the solder alloy. A no-clean solder paste is recommended as ultrasonic agitation wash of the CMA3000 component is prohibited. The solder paste must be suitable for printing it through the stencil aperture dimensions. Type 3 paste is recommended (grain size 25-45µm). ...
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... Component Picking The CMA3000 component can be picked from the carrier tape using vacuum nozzles. Pick up nozzles are available in various sizes and shapes to suit a variety of different component geometries recommended to that different pick up nozzles are tested to find the best one suited for the purpose ...
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... As a general guide, one thermo-couple should be placed under a component having the largest thermal mass, one next to the smallest component, one should be in contact with CMA3000 component's solder joint, and others to the appropriate spots on a circuit board, e.g. corner, center, bottom of the board etc. The reflow profile should be adjusted according to the measured data so that each solder joint experiences an optimal reflow profile ...
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... Moisture sensitivity level (MSL) classification The Moisture Sensitivity Level of the CMA3000 component is Level 2 according to the IPC/JEDEC J-STD-020D. The part is delivered in a dry pack. The manufacturing floor time (out of bag) at the customer’s end is 1 year. Maximum soldering peak temperature for the CMA3000 component is 260° ...
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... Figure 12. Cross section image of a properly soldered CMA3000 component. Figure 13. Gap between the component and the PWB. VTI Technologies Oy www.vti.fi PRELIMINARY Subject to changes TN68 CMA3000 Assembly Instructions 14/18 Rev.09 ...
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... Occasionally, very rough rework methods are used such as hand placement and heating with a soldering iron. However, these rough methods are not recommended for CMA3000 component recommended that the heat flow of hot-air convection directed at the edge and under the component body directly to the solder joints and component pad areas would be used ...
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... Hand Soldering Guidelines Hand soldering of the CMA3000 component with soldering iron is not recommended. For proto- uses of the CMA3000 component, VTI can provide pre-assembled component on a PWB. For more information on this, please find the document CMA3000-D0X PWB specification 8287500A and CMA3000-D0X PWB specification 8287600A ...
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... Figure 14 Offset settling (N=96) after the reflow VTI Technologies Oy www.vti.fi Offset settling Time [h] PRELIMINARY Subject to changes TN68 CMA3000 Assembly Instructions 17/18 Rev.09 ...
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... Recommended max number of reflow cycles (3) added, fig 10 replaced with the one from standard, reference to JEDEC std reflow profile added. 4.8.2009 Note on the index mark visibility added in p5 0.9 VTI Technologies reserves all rights to modify this document without prior notice. VTI Technologies Oy www.vti.fi PRELIMINARY Subject to changes TN68 CMA3000 Assembly Instructions 18/18 Rev.09 ...