2SK1153 Hitachi Semiconductor, 2SK1153 Datasheet

no-image

2SK1153

Manufacturer Part Number
2SK1153
Description
Silicon N-Channel MOS FET
Manufacturer
Hitachi Semiconductor
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
2SK1153
Manufacturer:
STC
Quantity:
5 000
Part Number:
2SK1153
Manufacturer:
REAESAS
Quantity:
20 000
Application
High speed power switching
Features
Outline
Low on-resistance
High speed switching
Low drive current
No secondary breakdown
Suitable for switching regulator and DC-DC converter
2SK1153, 2SK1154
Silicon N-Channel MOS FET
TO-220AB
G
S
D
1
2
3
1. Gate
2. Drain
3. Source
(Flange)

Related parts for 2SK1153

2SK1153 Summary of contents

Page 1

... Silicon N-Channel MOS FET Application High speed power switching Features Low on-resistance High speed switching Low drive current No secondary breakdown Suitable for switching regulator and DC-DC converter Outline TO-220AB Gate 2. Drain (Flange) 3. Source ...

Page 2

... Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Notes duty cycle 2. Value Symbol ...

Page 3

... Gate to source breakdown voltage Gate to source leak current Zero gate voltage 2SK1153 I drain current 2SK1154 Gate to source cutoff voltage Static Drain to source 2SK1153 R on stateresistance 2SK1154 Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time ...

Page 4

... Power vs. Temperature Derating Case Temperature T Typical Output Characteristics Pulse Test Drain to Source Voltage V 4 0.1 0.5 0.2 0.01 0.05 100 150 (° (V) DS Maximum Safe Operation Area ...

Page 5

... V DS Pulse Test 0.2 0.1 120 160 0.05 (°C) 2SK1153, 2SK1154 Static Drain to Source on State Resistance vs. Drain Current Pulse Test 0.2 0.5 1 Drain Current I (A) D Forward Transfer Admittance vs. Drain Current = 10 V –25° 25°C C 75°C ...

Page 6

... Body to Drain Diode Reverse Recovery Time 1,000 di/dt = 100 25°C 500 Pulse Test 200 100 0.05 0.1 0.2 0.5 Reverse Drain Current I Dynamic Input Characteristics 500 V = 100 V DD 250 V 400 V 400 V DS 300 200 V = 400 V 100 DD 250 V 100 Gate Charge Qg (nc) ...

Page 7

... V GS 0.4 0.8 1.2 1.6 Source to Drain Voltage V ( 100 m Pulse Width PW (s) Vout Monitor Vin R L Vout . (on) 2SK1153, 2SK1154 2 25°C C ch–c(t) = (t) · ch–c S ch–c = 4.17°C/ 25° Wavewforms ...

Page 8

MAX 10.16 0.2 9.5 8.0 1.5 MAX 0.76 2.54 0.5 2.54 +0.1 3.6 -0.08 0.1 0.5 0.5 Hitachi Code JEDEC EIAJ Weight (reference value) 4.44 0.2 1.26 0.15 2.7 MAX 0.1 TO-220AB Conforms Conforms 1.8 g Unit: mm ...

Page 9

... This product is not designed to be radiation resistant one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. ...

Related keywords