BU2522AF Philips Semiconductors, BU2522AF Datasheet
BU2522AF
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BU2522AF Summary of contents
Page 1
... kHz kHz Csat PIN CONFIGURATION case CONDITIONS average over any 20 ms period ˚C hs CONDITIONS with heatsink compound in free air 1 Product specification BU2522AF TYP. MAX. UNIT - 1500 V - 800 5 0.16 0.22 s ...
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... CONDITIONS MHz 6 170 H; Csat 5 B(end 0 (-dI /dt 3. Product specification BU2522AF MIN. TYP. MAX. UNIT - 2500 MIN. TYP. MAX. UNIT - - 0. 2 0.25 mA 7.5 13 800 ...
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... VCEOsust . Fig.5. Switching times test circuit . CEOsust ICsat t I end B t IBend -VBB t Fig.6. Test Circuit RBSOA 100 - 400 Product specification BU2522AF ICsat IBend t - IBM + 150 v nominal adjust for ICsat Lc LB T.U.T. Cfb VCC LC LB T.U.T. = 140 V; -V ...
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... 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1 sat = parameter PTOT / W BU2522AF/DF/AX/DX Ths = 25 C Ths = 85 C 0 85˚ parameter kHz B C BU2522AF ts 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1 parameter kHz 85˚C; ...
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... 0. Fig.16. Forward bias safe operating area. T 1E+00 I & I CDC Second-breakdown limits independant of temperature BU2522AF 1500 T j jmax 5 Product specification BU2522AF BU2520AF tp = ICM = 0. ICDC 100 us Ptot 100 1000 VCE / single pulse; parameter t CM ...
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... Fig.17. SOT199; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1997 15.3 max 3.1 3.3 7.3 6.2 5.8 3 1.2 1.0 5.45 5.45 6 Product specification BU2522AF 5.2 max 3.2 seating plane 3.5 max not tinned 0.7 max 0.4 M 2.0 Rev 1.400 o 45 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 7 Product specification BU2522AF Rev 1.400 ...