BU2523DF Philips Semiconductors, BU2523DF Datasheet
BU2523DF
Related parts for BU2523DF
BU2523DF Summary of contents
Page 1
... 1 kHz kHz Csat PIN CONFIGURATION case CONDITIONS average over any 20 ms period ˚C hs CONDITIONS with heatsink compound in free air 1 Product specification BU2523DF TYP. MAX. UNIT - 1500 V - 800 5 2.2 V 0.15 0.3 ...
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... 5 CONDITIONS 200 H; C Csat 145 0. B(end Product specification BU2523DF MIN. TYP. MAX. UNIT - 2500 MIN. TYP. MAX. UNIT - - 1 2 130 170 mA 7.5 13 800 ...
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... ICsat Lc D.U.T. LB Cfb Rbe Fig.4. Switching times test circuit . BU2523DF/X VCE = 1 V Ths = 25 C Ths = BU2523DF/X VCE = 5 V Ths = 25 C Ths = 100 = 100 = Rev 1.200 ...
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... Fig.11. Normalised power dissipation. C BU2523AF/DF/AX/DX 10 Ths = 25 C Ths = 0.1 0.01 0.001 1.5 2 Fig.12. Transient thermal impedance. 4 Product specification BU2523DF BU2523AF/DF/AX/DX 0 85˚ kHz Normalised Power Derating PD% with heatsink compound 100 ...
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... Ic(sat) ( VCL 3 2 CFB 150 V; CC Fig.15 0 BU2523 Area where fails occur 1000 1500 T j jmax 5 Product specification BU2523DF BU2523AF/ frequency (kHz) during normal running vs. frequency of Csat operation for optimum performance 80 Rev 1.200 ...
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... Fig.16. SOT199; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1997 15.3 max 3.1 3.3 7.3 6.2 5.8 3 1.2 1.0 5.45 5.45 6 Product specification BU2523DF 5.2 max 3.2 seating plane 3.5 max not tinned 0.7 max 0.4 M 2.0 Rev 1.200 o 45 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 7 Product specification BU2523DF Rev 1.200 ...