BU1508DX Philips Semiconductors, BU1508DX Datasheet
BU1508DX
Related parts for BU1508DX
BU1508DX Summary of contents
Page 1
... B(end) PIN CONFIGURATION case CONDITIONS average over any 20 ms period ˚C hs CONDITIONS with heatsink compound in free air 1 Product specification BU1508DX TYP. MAX. UNIT - 1500 V - 700 1 0.4 0.6 s ...
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... 4 4 CONDITIONS MHz 4 1 B(end (-dI / Product specification BU1508DX MIN. TYP. MAX. UNIT - 2500 MIN. TYP. MAX. UNIT - - 1 2.0 mA 140 - 390 mA 7.5 13 ...
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... IBM Fig.5. Typical base-emitter saturation voltage. + 150 v nominal 1.0 adjust for ICsat 0.9 0.8 0.7 1mH 0.6 0.5 0.4 0.3 12nF 0.2 0.1 0 0.1 Fig.6. Typical collector-emitter saturation voltage. 3 Product specification BU1508DX 125 0 parameter V CE VBESAT / 125 C IC/IB sat = parameter ...
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... Fig.11. Normalised power dissipation. C Zth / (K/ 0.05 0.02 0 0.01 10 1E-06 = 85˚C Fig.12. Transient thermal impedance Product specification BU1508DX 4.5A 3. parameter 85˚ Normalised Power Derating with heatsink compound 100 120 140 ...
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... Fig.13. Forward bias safe operating area. T Region of permissible DC operation Extension for repetitive pulse operation. NB: Mounted with heatsink compound and 30 5 newton force on the centre of the envelope. September 1997 100 1000 VCE / V = 25˚ Product specification BU1508DX Rev 1.300 ...
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... Fig.14. SOT186A; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1997 10.3 max 3.2 3.0 2.8 seating 15.8 19 max. max. plane 3 2 2.54 0.5 5.08 6 Product specification BU1508DX 4.6 max 2.9 max 6.4 15.8 max 0.6 2.5 1.3 Rev 1.300 1.0 (2x) 0.9 0.7 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 7 Product specification BU1508DX Rev 1.300 ...