TDA1311AT Philips Semiconductors, TDA1311AT Datasheet - Page 10

• Manufacturer Part Number: TDA1311AT
• Description: Stereo Continuous Calibration DAC CC-DAC
• Manufacturer: Philips Semiconductors

Philips Semiconductors
APPLICATION INFORMATION
Basic application example
A typical example of a CD-application with the TDA1311A; AT is shown in Fig.6. It features typical decoupling
components and a third-order analog post-filter stage providing a line output.
Attention to printed circuit board layout
The TDA1311A and even more so the TDA1311AT offers
great ease in designing-in to printed-circuit boards due to
its small size and low pin count. The TDA1311A; AT being
a mixed-signal IC in CMOS, some attention needs to be
paid to layout and topology of the application PCB.
Following some basic rules will yield the desired
performance. The most important considerations are:
1. Supply: care should be taken to supply the
2. Grounding: preferably a ground plane should be used,
1995 Dec 18
handbook, full pagewidth
Stereo Continuous Calibration DAC
(CC-DAC)
TDA1311A; AT with a clean, noiseless V
noise performance of the analog parts of the DAC.
Supply purity can easily be achieved by using an
RC-filtered supply.
in order to have a low-impedance return available at
any point in the layout. It is advantageous to make a
partitioning of the ground plane according to the nature
of the expected return currents (digital input returns
separate from supply returns and separate from the
analog section).
V DD
DATA
10
BCK
Fig.6 Example of a 3rd order filter application.
WS
1
2
3
47
TDA1311AT
F
DD
TDA1311A
, for a good
4
100
nF
5
8
7
6
10
3. Topology: the capacitor decoupling high-frequency
Figure 7 shows recommended layouts for printed-circuit
boards for the SO8 and DIL8 versions respectively. Both
layouts use a single-interconnect layer.
2.2 nF
2.2 nF
22 k
22 k
420 pF
420 pF
supply interference from V
as close as is physically possible to the IC body,
ensuring a low-inductance path to ground. The digital
input conductors may be shielded by ground leads
running alongside. The placement of a passive ground
plane underside the entire IC surface gives `free`
additional decoupling from the IC body to ground as
well as providing a shield between the digital input pins
and the analog output pins.
22 k
22 k
100 pF
100 pF
DD
MBG863
to GND should be placed
Preliminary specification
TDA1311A