TDA5146T Philips Semiconductors, TDA5146T Datasheet - Page 16

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TDA5146T

Manufacturer Part Number
TDA5146T
Description
Brushless DC motor drive circuit
Manufacturer
Philips Semiconductors
Datasheet

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Philips Semiconductors
Product specification
Brushless DC motor drive circuit
TDA5146T
SOLDERING
Plastic mini–packs
BY WAVE
During placement and before soldering, the component must be fixed with a droplet of adhesive. After cutting the adhesive, the component can
be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispending.
Maximum permissible solder temperature is 260 C; and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to
less than 150 C within 6 s. Typical dwell time is 4 s at 250 C.
A modified wave soldering technique is recommended using two solder waves (dual–wave), in which a turbulent wave with high upward
pressure is followed by a smooth laminar wave. Using a mildly activated flux eliminates the need for removal of corrosive residues in most
applications.
BY SOLDER PASTE REFLOW
Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen
printing, stencilling or pressure–syringe dispending before device placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared and vapor–phase reflow. Dwell times vary
between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 C.
REPAIRING SOLDERED JOINTS (BY HAND–HELD SOLDERING IRON OR PULSE–HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must
be limited to 10 s at up 300 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and
320 C. Pulse–heated soldering is not recommended for SO packages.
For pulse–heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead
plating before package placement.
Plastic dual in–line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for more than 5 s. The total
contact time of successive solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If
the printed–circuit board has been pre–heated, forced cooling may be necessary immediately after soldering to keep the temperature within the
permissible limit.
1994 May 18
16

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