TDA7571 STMicroelectronics, TDA7571 Datasheet

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TDA7571

Manufacturer Part Number
TDA7571
Description
STPDACsw - Fully digital high efficiency power audio amplifier
Manufacturer
STMicroelectronics
Datasheet

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Features
Description
The TDA7571 i is a fully digital switchmode power
audio amplifier with I
output.
Table 1.
September 2007
Output power 2 x 70W / 1 x 250W @ THD<1%
I
PWM output (F
MCLK input = 256 x F
Operation on 24bit
±30V supply voltage (Max.)
St-by
Mute
Stereo/bridge operation selection
Protections against short circuit across the load
Chip thermal protection
External temperature sensor possibility
Thermal warning pins
Adjustable clip detector pin
2
S input (F
STPDACsw - Fully digital high efficiency power audio amplifier
Order code
Device summary
TDA7571
S
= 38 to 48kHz)
PWM
2
S digital input and PWM
= F
S
S
x 8)
HiQUAD-64
Package
Rev 1
The maximum output current and voltage swing
are depending by the output circuitry (power
supply, external power transistors and sensing
resistors). The device can work as a stereo
single-ended channels or a mono bridge power
amplifier.
HiQUAD-64
Packing
Tray
TDA7571
www.st.com
1/21
21

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TDA7571 Summary of contents

Page 1

... Protections against short circuit across the load ■ Chip thermal protection ■ External temperature sensor possibility ■ Thermal warning pins ■ Adjustable clip detector pin Description The TDA7571 fully digital switchmode power audio amplifier with I output. Table 1. Device summary Order code TDA7571 September 2007 = ...

Page 2

... Short circuit protection current calculation . . . . . . . . . . . . . . . . . . . . . . . . 14 External thermal protection network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Internal thermal protection network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Feedback . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Gate driving network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Dither . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 External connections description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.8.1 CD, THWEXT, THWINT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.8.2 MUTE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.8.3 ST-BY - St-By pin 4.8.4 +Vs-low - . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.8.5 DATA, SEL, SCK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.8.6 MCLK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.8.7 DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.8.8 BRIDGE and L Components with critical placement and type . . . . . . . . . . . . . . . . . . . . . 18 TDA7571 Figure 3 and ...

Page 3

... TDA7571 1 Block and simplified application diagram Figure 1. Block and simplified application diagram L/R MCLK 34 46 MASTER CLOCK 48 SD DATA 49 WS WORD SEL www.DataSheet4U.com 50 SCK CLOCK R10 RFS 35 SGND PGND SEL1 30 CD SEL2 DIG 37 THW EXT 36 R1 THW INT C2 38 NTC ...

Page 4

... Not connected Gpr Gate PMOS, right channel Gprs Sense gate PMOS, right channel +Vs-5 Spr2 Sensing 2 PMOS, right channel Spr1 Sensing 1 PMOS, right channel +Vs-Vref1 Supply drivers PMOS pgnd Power ground N.C. Not connected TDA7571 -2.5V 51 N.C. 50 SCK MCLK ...

Page 5

... TDA7571 Table 2. Pin number www.DataSheet4U.com Pins description (continued) Name Function +Vs Positive power supply Spl1 Sensing 1 PMOS, left channel Spl2 Sensing 2 PMOS, left channel -Vs+5 N.C. Not connected ...

Page 6

... Negative voltage supply -Vs+Vrefr Supply drivers NMOS. Right channel Snr1 Sensing 2 NMOS, right channel Snr2 Sensing 1 NMOS, right channel Gnrs Sense gate NMOS, right channel Gnr Gate NMOS, right channel TDA7571 Voltage limit Voltage limit (low) (high -2.75V 0 (ref) 2 ...

Page 7

... Output offset voltage os P Output power o P Output power o Power dissipation of the P d TDA7571 Absolute maximum ratings Parameter Operating supply voltage Junction temperature, operating range Storage temperature, operating range Thermal data Parameter Thermal resistance junction to case = 4Ω 1kHz 25° 44.1kHz, Single-Ended, application circuit shown ...

Page 8

... V = 1Vrms o sensor gs sensor 1Vrms 100Hz 0.5V r pin: ST-BY, MUTE, SD, WS, SCK, MCLK bridge D1, D2. (these pins are typically connected to the DGND or 5V dig pins) TDA7571 Min. Typ. Max. Unit 10 W 0 Vrms 180 µV 100 100 ...

Page 9

... TDA7571 Table 5. Electrical characteristics (continued ±25V Figure Symbol Clip detector Clip detector pin operating Vcd voltage (open drain) CDl Clip detector pin leakage current CD off CDs Clip detector pin saturation voltage CD on, 1mA www.DataSheet4U.com CDi Clip detector THD intervention Protections ...

Page 10

... T = 25° 44.1kHz, Single-Ended, application circuit shown 65W/1 x 130W system, unless otherwise specified.) Parameter Test condition Reference: dgnd pin Reference: sgnd pin Reference: sgnd pin Reference pin Reference pin TDA7571 Min. Typ. Max. Unit 2.7 A 2 ...

Page 11

... TDA7571 Figure 3. PLL option diagram www.DataSheet4U.com Electrical specifications 11/21 ...

Page 12

... Electrical specifications Figure 4. Free running oscillator option diagram www.DataSheet4U.com 12/21 TDA7571 ...

Page 13

... TDA7571 3.4 Notes on the electrical schematic shown in 3.4.1 Main characteristics ● 2 channels single-ended or 1 channel bridge PWM amplifier ● Power output: see ● Figure ● Figure ● Output voltage @ input = -6Bfs: – www.DataSheet4U.com – ● Clip detector settled at THD=10% ● No dithering selected The schematic is depicted showing the suggested structure of the printed circuit board tracks (star points, high current path, components placement) ...

Page 14

... External thermal warning temperature intervention: 90 °C External thermal shut down temperature intervention: 100 °C External thermal shut down hysteresis: 6°C TDA7571 SPx2 pin Rp2 Vp=100mV Typ comparator SPx1 pin ⋅ ⎞ Rp1 Rp2 + Vfil + ⎠ Rp2 ) ← if Rp2 is not used ) is present. S TDA7571 ...

Page 15

... TDA7571 4.3 Internal thermal protection network The purpose of this function is to sense the chip temperature. Because of the power dissipation of this device is almost constant (is not dependent by the output power), the system must be designed to avoid chip temperature higher than 140 °C. The internal thermal protection is intended to avoid dangerous situations due to, as example, damaged power transistors (gate-source shorted) or bad environments conditions ...

Page 16

... For high quality signals suggested do not use the cases 3 and 4, that can be useful only in case of low resolution signals without noise added. 16/21 Figure 3, the internal oscillator is locked by a PLL circuit 4 types of digital dithering TDA7571 D2 Dithering 0 Low 1 Mid-low 0 Mid-high 1 High ...

Page 17

... TDA7571 4.8 External connections description 4.8.1 CD, THWEXT, THWINT These pins, if used, it must be connected to a pull-up resistor (>10kOhm) connected to a supply voltage referred to the receiver device (as example, a µP). Maximum voltage = 6V. 4.8.2 MUTE Mute pin www.DataSheet4U.com 4.8.3 ST-BY - St-By pin. To avoid pop noise due to multiple ST-BY parasitic pulses, an R-C network must be added (as example 47kOhm, 0.1µ ...

Page 18

... The capacitors placed between +Vs to GND and to -Vs are distributed along the power lines. With P.C. board with very short connections, some of these capacitors can be avoided (Cvs-1, Cvs-2, Cd3, Cd4, Cd8, Cd7). www.DataSheet4U.com ● The current sensing resistors Rsens-N-L, Rsens-P-L, Rsens-P-R and Rsens-N-R must be not inductive components, as example, made by a constant an wire. 18/21 TDA7571 ...

Page 19

... TDA7571 5 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...

Page 20

... Revision history 6 Revision history Table 8. Date 3-Sep-2007 www.DataSheet4U.com 20/21 Document revision history Revision 1 Initial release. TDA7571 Changes ...

Page 21

... TDA7571 www.DataSheet4U.com Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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