TDA8034HN Philips Semiconductors, TDA8034HN Datasheet
TDA8034HN
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TDA8034HN Summary of contents
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... Rev. 01 — 5 February 2010 1. General description The TDA8034HN is a cost-effective analog interface for asynchronous and synchronous smart cards operating 1.8 V. Using few external components, the TDA8034HN provides all supply, protection and control functions between a smart card and the microcontroller. 2. Features I ...
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... I < 200 mA < 400 ns; 1.8 V card from 20 kHz to 200 MHz 1 see Figure 8 on page +85 C amb Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface Min Typ Max 4.85 5 5.5 3 3.3 5.5 2.7 3.3 3.6 1 ...
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... ALARMN EN1 PVCC SEQUENCER EN4 EN3 CLOCK EN2 CLK CIRCUIT CRYSTAL THERMAL OSCILLATOR PROTECTION TDA8034HN 23 24 XTAL1 XTAL2 Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface Version SOT616 100 nF V DDP LDO 470 nF 14 RST RESET ...
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... GND using one 470 nF capacitor close to pin V and one 220 nF capacitor close to card socket contact C1 with an ESR < 100 m Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface 18 PORADJ 17 V ...
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... I = input output, I/O = input/output ground and P = power supply. [2] If pin PRESN is HIGH, the card is considered to be present. During card insertion, debouncing can occur on these signals. To counter this, the TDA8034HN has a built-in debouncing timer (typically 8 ms). [3] Uses an internal 11 k pull-up resistor connected to pin V ...
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... V DD(INTF) inactive irrespective of the command line levels. After hys sent to a digital controller in order to reset the TDA8034HN. This defined reset pulse of approximately 8 ms, i.e. (t Shutdown mode during the supply voltage power on; see sequence is performed when either V Remark: f parameter. V (internal signal) Fig 4 ...
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... The clock signal from pin CLK to the card is either supplied by an external clock signal connected to pin XTAL1 or generated using a crystal connected between pins XTAL1 and XTAL2. The TDA8034HN automatically detects if an external clock is connected to XTAL1, eliminating the need for a separate pin to select the clock source. ...
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... I/O lines is limited maximum frequency of 1 MHz. 8.5 Shutdown mode After a power-on reset, if pin CMDVCCN is HIGH, the circuit enters the Shutdown mode, ensuring only the minimum number of circuits are active while the TDA8034HN waits for the microcontroller to start a session. • ...
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... CC Shutdown and Deep shutdown mode activation/deactivation 1 fosc(int)low called t fosc(int)high d(start) Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface shutdown debounce and t5 is called t . d(end) © NXP B.V. 2010. All rights reserved. activation 001aal139 ...
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... I/OUC OSCINT Fig 7. 8.8 Deactivation sequence When a session ends, the microcontroller sets pin CMDVCCN HIGH. The TDA8034HN then executes an automatic deactivation sequence by counting the sequencer back to the inactive state (see 1. Pin RST is pulled LOW (t11). 2. The clock is stopped, pin CLK is LOW (t12). ...
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... Product data sheet high frequency t10 t11 t12 t13 t deact OSCINT = internal oscillator. Deactivation sequence CC falling falling Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface low frequency t14 = 1 © NXP B.V. 2010. All rights reserved. 001aak995 Table 8. is detected ...
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... On card insertion or removal, bouncing can occur in the PRESN signal. This depends on the type of card presence switch in the connector (normally open or normally closed) and the mechanical characteristics of the switch. To correct for this, a debouncing feature is integrated in to the TDA8034HN. This feature operates at a typical duration 640 deb feature ...
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... RST AUX1, AUX2, CLK, PRESN; CC within typical application Human Body Model (HBM); all other pins Machine Model (MM); all pins Field Charged Device Model (FCDM); all pins Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface t deb (2) 001aal411 CC can cause permanent damage to ...
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... DD pin 100 DDP CC 5.1 pin PORADJ < 0.5 V 0.1 pin PORADJ > [2] 550 CC Shutdown mode no load 0 0.1 o Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface Conditions Typ in free air unless otherwise specified. Typ Max 5 5.5 3.3 5.5 3.3 3 ...
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... XTAL1 0 0.3 external clock 0.3 crystal oscillator 0.7V external clock 0.7V falling edge on pins I/O and - I/OUC or vise versa 200 on data lines - on data lines - Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface = 25 C; unless otherwise specified. Typ Max - 1 5.0 5.25 3.05 3.15 1.83 1.89 5.0 5.25 - 3.20 - 1.94 - ...
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... load 0. > 0.75V OH DD(INTF < 0.75V OH DD(INTF) 0.3 0.7V pin I/OUC - DD(INTF Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface = 25 C; unless otherwise specified. Typ Max - 0 0 0.1 CC ...
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... Shutdown mode; pin CLK - grounded I = 200 current limit 200 A 0.9V OH current limit [ [ operational 0 Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface = 25 C; unless otherwise specified. Typ Max 1.2 - 0.1 - 1 150 200 2.7 3.2 - 0 0.3 - ...
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... PRESN - < DD(INTF < V < DD(INTF 0.75V OH connected DD(INTF DD(INTF) Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface = 25 C; unless otherwise specified. amb Typ Max - [6] 0.3 - 0.3V DD(INTF DD(INTF) DD(INTF) 0.14V - DD(INTF ...
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... Figure 7 on page 10 d(start t5; see Figure 7 on page 10 d(end) pin PRESN Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface 19 (t1 + t2). for states of pins CLKDIV1 and CLKDIV2. . DD(INTF) Min Typ Max 15 - +15 135 175 225 ...
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... RSTIN 3 TDA8034HN VCC_SEL1 4 CMDVCCN 5 GND CLKDIV1 CARD CONNECTOR Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface PORADJ 100 nF DDP RST V 14 DDP CLK ...
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... 2.5 scale (1) ( 2.25 4.1 2.25 0.5 2.5 2.5 1.95 3.9 1.95 REFERENCES JEDEC JEITA MO-220 - - - Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface detail 0.5 0.05 0.1 0.1 0.05 0.3 EUROPEAN ISSUE DATE PROJECTION 01-08-08 02-10-22 © NXP B.V. 2010. All rights reserved. ...
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... Solder bath specifications, including temperature and impurities TDA8034HN_1 Product data sheet Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface © NXP B.V. 2010. All rights reserved ...
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... Lead-free process (from J-STD-020C) Package reflow temperature ( C) 3 Volume (mm ) < 350 260 260 250 Figure 14. Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface Figure 14) than a SnPb process, thus 350 220 220 350 to 2000 > 2000 260 260 250 245 ...
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... ElectroStatic Discharge Equivalent Series Resistor Field Charged Device Model Human Body Model Low Drop-Out Machine Model Negative-channel Metal-Oxide Semiconductor Power-On Reset Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface peak temperature time 001aac844 © NXP B.V. 2010. All rights reserved ...
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... NXP Semiconductors 16. Revision history Table 13. Revision history Document ID Release date TDA8034HN_1 20100205 TDA8034HN_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface Supersedes - © NXP B.V. 2010. All rights reserved ...
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... It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface © NXP B.V. 2010. All rights reserved ...
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... NXP Semiconductors’ product specifications. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface © NXP B.V. 2010. All rights reserved ...
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... Protection characteristics . . . . . . . . . . . . . . . . .19 Table 9. Timing characteristics . . . . . . . . . . . . . . . . . . .19 Table 10. SnPb eutectic process (from J-STD-020C .23 Table 11. Lead-free process (from J-STD-020C .23 Table 12. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .24 Table 13. Revision history . . . . . . . . . . . . . . . . . . . . . . . .25 TDA8034HN_1 Product data sheet Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface © NXP B.V. 2010. All rights reserved ...
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... Fig 11. Definition of output and input transition times . . .19 Fig 12. Application diagram . . . . . . . . . . . . . . . . . . . . . . .20 Fig 13. Package outline SOT616-1 (HVQFN24 .21 Fig 14. Temperature profiles for large and small components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 TDA8034HN_1 Product data sheet . . . . . . . . . . . . . . .13 CC Rev. 01 — 5 February 2010 TDA8034HN www.DataSheet4U.com Smart card interface © NXP B.V. 2010. All rights reserved ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document identifier: TDA8034HN_1 Smart card interface All rights reserved. Date of release: 5 February 2010 ...