MCP602

Manufacturer Part NumberMCP602
DescriptionMCP601-2-3-4
ManufacturerN/A
MCP602 datasheet
 


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8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
p
n
B
c
Dimension Limits
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
2003 Microchip Technology Inc.
E
E1
D
2
1
A1
L
Units
INCHES
MIN
NOM
MAX
n
8
p
.026
A
.043
A2
.033
.035
.037
A1
.002
.004
.006
E
.246
.251
.256
E1
.169
.173
.177
D
.114
.118
.122
L
.020
.024
.028
0
4
8
c
.004
.006
.008
B
.007
.010
.012
0
5
10
0
5
10
MCP601/2/3/4
A
A2
MILLIMETERS*
MIN
NOM
MAX
8
0.65
1.10
0.85
0.90
0.95
0.05
0.10
0.15
6.25
6.38
6.50
4.30
4.40
4.50
2.90
3.00
3.10
0.50
0.60
0.70
0
4
8
0.09
0.15
0.20
0.19
0.25
0.30
0
5
10
0
5
10
DS21314E-page 21