BCM2045 Broadcom Corporation, BCM2045 Datasheet

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BCM2045

Manufacturer Part Number
BCM2045
Description
BLUTONIUM BLUETOOTH 2.0 + EDR SINGLE-CHIP HCI SOLUTION
Manufacturer
Broadcom Corporation
Datasheet

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BLUTONIUM® BLUETOOTH® 2.0 + EDR SINGLE-CHIP HCI SOLUTION
World’s first Bluetooth 2.0 + EDR solution in 0.13 um CMOS
technology
Fully integrated balun and T/R switch eliminates all external
RF matching components
Supports class 1, 2, and 3 designs
Fully supports the Bluetooth 1.1, 1.2, and 2.0 standards
including 1, 2, and 3 Mbps EDR operation
Lowest current consumption in all modes of operation
ROM-based solution eliminates external flash and/or
EEPROM memory
Highest available Bluetooth radio performance of any single-
chip solution
• 88 dBm receiver sensitivity using EDR communication
• Programmable output power up to +7 dBm
Minimized external BOM requirements are less than 10
external passive components
Supports UART, USB, SDI, and SPI HCI transports
Fractional-N frequency synthesizer supports any crystal or
TCXO source from 12 to 40 MHz
Automatic calibration and frequency detection of crystal
frequency
F E A T U R E S
Voice Codec
Baseband
LPO Clock
Handset
®
TCXO
Typical Cell Phone Application
HOST_WAKE
XTAL_PD/PU
LPO_INPUT
BT_WAKE
XTAL_IN
UART
PCM
www.DataSheet4U.com
BCM2045
Cellular and mobile communication devices
PDA and low-power embedded communication devices
PC and integration on PC mother board applications
Package types available
• 95-pin fpBGA package (6 mm x 6 mm)
• 65-pin fpBGA package (5 mm x 5 mm)
• Wafer scale flip chip packaging
Maximizes range and simplifies system integration by
providing exceptional output power and receiver sensitivity
High-level of integration eliminates challenges of board level
RF design
Achieves smallest board area requirements by minimal
external BOM and smallest package size available today
• Standard PCB requirement is less than 50 mm^2
• Module solutions less than 25 mm^2
ROM-based solution with flexible code patching ensures fast
integration
On-chip voltage regulator lowers BOM requirements and
provides additional power savings capability
Minimized power dissipation over other solutions
• 50% savings in power in standard telephony headset
• 30% savings in power in advanced stereo audio applications
BCM2045
applications
S U M M A R Y O F B E N E F I T S
A P P L I C A T I O N S

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BCM2045 Summary of contents

Page 1

... PC and integration on PC mother board applications • Package types available • 95-pin fpBGA package ( mm) • 65-pin fpBGA package ( mm) • Wafer scale flip chip packaging Typical Cell Phone Application PCM UART BT_WAKE HOST_WAKE BCM2045 XTAL_PD/PU XTAL_IN LPO_INPUT ...

Page 2

... Bluetooth 2.0 + EDR. By designing the radio to take advantage of EDR, higher and more reliable through-and greater-link range performance can be achieved. Cost optimized solutions can be achieved with the BCM2045 by using standard chip-on-board assembly techniques. Low risk applications are enabled through the extensive integration of external passive and active components ...

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